Proceedings of the 2016 International Conference on Computer Science and Electronic Technology

Diffusion Performance of Moisture in Conductive Adhesive Interconnection Structure

Authors
Yang Lu, Dejian Zhou
Corresponding Author
Yang Lu
Available Online August 2016.
DOI
https://doi.org/10.2991/cset-16.2016.56How to use a DOI?
Keywords
Conductive adhesive, DGEBA, MPD, diffusion coefficient, molecular dynamics
Abstract
This paper studied on the environment temperature and humidity setting of conductive adhesive in microelectronic packaging, and established DGEBA /MPD linear homo-polymer model which simplified the conductive adhesive based on material Studio software , to access to diffusion mean square displacement curve in the different temperature and humidity water in DGEBA /MPD polymer. Based on the Einstein formula, through the mean square displacement curve to calculate the slope (a) showed that under the same low humidity conditions, the temperature is high, the water diffusion coefficient is larger, the diffusion is faster. According to different humidity conditions, under the same temperature and low humidity conditions, the diffusion coefficient of water molecules increases with the increase of humidity. Correlation algorithm simulated the diffusion of water molecules and it helped to improve the efficiency of the use of conductive adhesive. Relevant analysis is helpful to guide the conductive adhesive interconnect process parameter settings.
Open Access
This is an open access article distributed under the CC BY-NC license.

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Proceedings
2016 International Conference on Computer Science and Electronic Technology
Part of series
Advances in Computer Science Research
Publication Date
August 2016
ISBN
978-94-6252-213-8
ISSN
2352-538X
DOI
https://doi.org/10.2991/cset-16.2016.56How to use a DOI?
Open Access
This is an open access article distributed under the CC BY-NC license.

Cite this article

TY  - CONF
AU  - Yang Lu
AU  - Dejian Zhou
PY  - 2016/08
DA  - 2016/08
TI  - Diffusion Performance of Moisture in Conductive Adhesive Interconnection Structure
BT  - 2016 International Conference on Computer Science and Electronic Technology
PB  - Atlantis Press
SP  - 238
EP  - 241
SN  - 2352-538X
UR  - https://doi.org/10.2991/cset-16.2016.56
DO  - https://doi.org/10.2991/cset-16.2016.56
ID  - Lu2016/08
ER  -