Micro Channel and Heat Transfer Column Structure Effect on Heat Dissipation Performance of LTCC Microwave Component by Numerical Simulation Analysis
Zhiping Liao, Zhaohua Wu
Available Online August 2016.
- https://doi.org/10.2991/cset-16.2016.61How to use a DOI?
- LTCC, micro channel, heat transfer column, heat dissipation performance
- Micro channel and heat transfer column of low temperature co-fired ceramic (LTCC) microwave component, its structural parameters will affect the heat transfer performance of high heat flux microwave module. To obtain the better thermal performance of micro channel and heat transfer column structure, a three-dimensional model of LTCC microwave component is established by the finite element software ANSYS. The heat dissipation performance of component was studied by numerical simulation. Research results show the influence of the heat transfer column diameter on the heat dissipation performance of component is the biggest, the second biggest is micro channel section width. When choosing the heat transfer column diameter of 0.3mm, micro channel section width of 1mm, heat transfer column height of 0.3mm, micro channel section height of 0.3 mm, the heat dissipation effect is the best, and the maximum temperature of the power chip is 43.64 , which can meet the requirements of the heat sink design of LTCC microwave components.
- Open Access
- This is an open access article distributed under the CC BY-NC license.
Cite this article
TY - CONF AU - Zhiping Liao AU - Zhaohua Wu PY - 2016/08 DA - 2016/08 TI - Micro Channel and Heat Transfer Column Structure Effect on Heat Dissipation Performance of LTCC Microwave Component by Numerical Simulation Analysis BT - 2016 International Conference on Computer Science and Electronic Technology PB - Atlantis Press SN - 2352-538X UR - https://doi.org/10.2991/cset-16.2016.61 DO - https://doi.org/10.2991/cset-16.2016.61 ID - Liao2016/08 ER -