Proceedings of the 2016 International Conference on Computer Science and Electronic Technology

Micro Channel and Heat Transfer Column Structure Effect on Heat Dissipation Performance of LTCC Microwave Component by Numerical Simulation Analysis

Authors
Zhiping Liao, Zhaohua Wu
Corresponding Author
Zhiping Liao
Available Online August 2016.
DOI
https://doi.org/10.2991/cset-16.2016.61How to use a DOI?
Keywords
LTCC, micro channel, heat transfer column, heat dissipation performance
Abstract
Micro channel and heat transfer column of low temperature co-fired ceramic (LTCC) microwave component, its structural parameters will affect the heat transfer performance of high heat flux microwave module. To obtain the better thermal performance of micro channel and heat transfer column structure, a three-dimensional model of LTCC microwave component is established by the finite element software ANSYS. The heat dissipation performance of component was studied by numerical simulation. Research results show the influence of the heat transfer column diameter on the heat dissipation performance of component is the biggest, the second biggest is micro channel section width. When choosing the heat transfer column diameter of 0.3mm, micro channel section width of 1mm, heat transfer column height of 0.3mm, micro channel section height of 0.3 mm, the heat dissipation effect is the best, and the maximum temperature of the power chip is 43.64 , which can meet the requirements of the heat sink design of LTCC microwave components.
Open Access
This is an open access article distributed under the CC BY-NC license.

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Proceedings
Part of series
Advances in Computer Science Research
Publication Date
August 2016
ISBN
978-94-6252-213-8
ISSN
2352-538X
DOI
https://doi.org/10.2991/cset-16.2016.61How to use a DOI?
Open Access
This is an open access article distributed under the CC BY-NC license.

Cite this article

TY  - CONF
AU  - Zhiping Liao
AU  - Zhaohua Wu
PY  - 2016/08
DA  - 2016/08
TI  - Micro Channel and Heat Transfer Column Structure Effect on Heat Dissipation Performance of LTCC Microwave Component by Numerical Simulation Analysis
PB  - Atlantis Press
SP  - 259
EP  - 262
SN  - 2352-538X
UR  - https://doi.org/10.2991/cset-16.2016.61
DO  - https://doi.org/10.2991/cset-16.2016.61
ID  - Liao2016/08
ER  -