Proceedings of the International Conference on Electronics, Mechanics, Culture and Medicine

Research on the Impacts of BIM on Information Exchange between Stakeholders in Construction Project

Authors
Yingnan Yang, Yanfei Jiang
Corresponding Author
Yingnan Yang
Available Online February 2016.
DOI
https://doi.org/10.2991/emcm-15.2016.139How to use a DOI?
Keywords
BIM; Information Exchange; Impact; Stakeholder; Project
Abstract
In order to analyze the impacts of BIM on information exchange between construction project stakeholders, this paper studied from three essential information exchange modes. At last, the simplified version of Shannon-Weaver model II was chosen as the analysis framework. The whole process of information exchange was gradually analyzed with the help of literature, conclusions were given as follows: because of the adoption of BIM, the supplier and demander of information may change; richer, more clear and accurate information were created; the efficiency of information transmission was improved and the possibility of wrong interpretation of information was reduced. Apart from this, these impacts may produce a series of effects, so project managers should consider about these impacts when they make decisions. Also, with the special analysis of the impacts, this paper can provide some advices for decision makers when they decide if they should adopt BIM even lacking of empirical support
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This is an open access article distributed under the CC BY-NC license.

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Proceedings
International Conference on Electronics, Mechanics, Culture and Medicine
Part of series
Advances in Computer Science Research
Publication Date
February 2016
ISBN
978-94-6252-163-6
ISSN
2352-538X
DOI
https://doi.org/10.2991/emcm-15.2016.139How to use a DOI?
Open Access
This is an open access article distributed under the CC BY-NC license.

Cite this article

TY  - CONF
AU  - Yingnan Yang
AU  - Yanfei Jiang
PY  - 2016/02
DA  - 2016/02
TI  - Research on the Impacts of BIM on Information Exchange between Stakeholders in Construction Project
BT  - International Conference on Electronics, Mechanics, Culture and Medicine
PB  - Atlantis Press
SP  - 765
EP  - 769
SN  - 2352-538X
UR  - https://doi.org/10.2991/emcm-15.2016.139
DO  - https://doi.org/10.2991/emcm-15.2016.139
ID  - Yang2016/02
ER  -