Numerical Simulation on the Water-cooled Heat Sink for High-power Semiconductor

DOI

10.2991/iccasm.2012.296How to use a DOI?

Keywords

FLUENT, Modeling, Numerical Simulation, Water-cooled Heat Sink

Abstract

With the development of electronic technology, the cooling of the electronic devices, especially for high-power semiconductor, becomes more and more important. The aircooled technology is gradually replaced by the water-cooled technology with the excellent cooling ability. This paper simulates the flow field and temperature field of water-cooled heat sink with FLUENT, obtains the heat transferring performance and hydrodynamics property of heat sink, and compares the simulation results with experimental results. The compared results find the disadvantages of heat sink structure and provide information for the improvement. The application of FLUENT, with the function of three-dimension modeling, hydro-dynamics calculation and heat transfer calculation, in the design of heat sink can improve the structure of heat sink, save manufacture cost, reduce exploitation time, and enhance the independent exploitation ability.

Copyright

© 2012, the Authors. Published by Atlantis Press.

Open Access

This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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TY  - CONF
AU  - Yanping Liu
AU  - Yuliang Yang
PY  - 2012/08
DA  - 2012/08
TI  - Numerical Simulation on the Water-cooled Heat Sink for High-power Semiconductor
BT  - Proceedings of the 2012 International Conference on Computer Application and System Modeling (ICCASM 2012)
PB  - Atlantis Press
SP  - 1161
EP  - 1164
SN  - 1951-6851
UR  - https://doi.org/10.2991/iccasm.2012.296
DO  - 10.2991/iccasm.2012.296
ID  - Liu2012/08
ER  -