Influences of Anti-G Suit Material Hygroscopicity on Thermal Stress Index of the Pilot

DOI

10.2991/icismme-15.2015.124How to use a DOI?

Keywords

Anti-G Suit; Thermal Stress Index; Heat and Moisture Transfer; Model; Simulation

Abstract

To investigate the influences of the fiber hygroscopicity on the pilot thermal responses, a heat and moisture transfer model for pilot/anti-G suit/environment system is developed. An improved Stolwijk model is used to simulate pilot thermal responses, and the coupled heat and moisture transfer model considering fiber hygroscopicity role is used for anti-G suit. The model is validated by literature experimental data. Then, effects of the fiber hygroscopicity on the pilot thermal stress index are analyzed by running the model program. Conclusion shows that the anti-G suit made of the fiber with high hygroscopicity can raise high thermal stress index of the pilot in high temperature and humidity environment.

Copyright

© 2015, the Authors. Published by Atlantis Press.

Open Access

This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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TY  - CONF
AU  - Fengzhi Li
AU  - Penghao Ren
PY  - 2015/07
DA  - 2015/07
TI  - Influences of Anti-G Suit Material Hygroscopicity on Thermal Stress Index of the Pilot
BT  - Proceedings of the First International Conference on Information Sciences, Machinery, Materials and Energy
PB  - Atlantis Press
SP  - 603
EP  - 608
SN  - 1951-6851
UR  - https://doi.org/10.2991/icismme-15.2015.124
DO  - 10.2991/icismme-15.2015.124
ID  - Li2015/07
ER  -