Proceedings of the First International Conference on Information Sciences, Machinery, Materials and Energy

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Simulation Research on Solder Joint Residual Strain Energy of Au80/Sn20 Eutectic Soldering GaAs Chip

Authors
Yajun Liu, Zhaohua Wu
Corresponding Author
Yajun Liu
Available Online July 2015.
DOI
10.2991/icismme-15.2015.306How to use a DOI?
Keywords
Au80/Sn20; eutectic soldering; FEM; residual stress; strain energy.
Abstract

After Au80/Sn20 eutectic soldering GaAs chips process, Au80/Sn20 solder joints will have large residual stress and strain because of materials’ coefficient of thermal expansion (CTE) mismatch. Large strain deformation will lead to the chip position migration. On the other hand too much stress can make the interface micro cracks and affect the quality and long-term reliability of Au80/Sn20 solder joints. Choosing welding pressure, cooling rate and the thickness of the precast solder pieces as the key process parameters, and designing the L16 (43) orthogonal test table. According to the Au80 / Sn20 eutectic soldering real environment, using finite element analysis software ANSYS to establish the simulation model of Au80 / Sn20 eutectic soldering process. After simulation analysis, it got the maximum residual stress and the strain energy of the solder joint. The primary of the factors is cooling rate, the secondary of the factors is the thickness of the precast solder pieces and pressure is the last by range analysis. The achieved process parameters and forming residual stress and the strain energy of the relationship between solder joints can provide reference and guidance for practical production.

Copyright
© 2015, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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Volume Title
Proceedings of the First International Conference on Information Sciences, Machinery, Materials and Energy
Series
Advances in Intelligent Systems Research
Publication Date
July 2015
ISBN
10.2991/icismme-15.2015.306
ISSN
1951-6851
DOI
10.2991/icismme-15.2015.306How to use a DOI?
Copyright
© 2015, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

Cite this article

risenwbib
TY  - CONF
AU  - Yajun Liu
AU  - Zhaohua Wu
PY  - 2015/07
DA  - 2015/07
TI  - Simulation Research on Solder Joint Residual Strain Energy of Au80/Sn20 Eutectic Soldering GaAs Chip
BT  - Proceedings of the First International Conference on Information Sciences, Machinery, Materials and Energy
PB  - Atlantis Press
SP  - 1439
EP  - 1444
SN  - 1951-6851
UR  - https://doi.org/10.2991/icismme-15.2015.306
DO  - 10.2991/icismme-15.2015.306
ID  - Liu2015/07
ER  -