Proceedings of the 2015 3rd International Conference on Machinery, Materials and Information Technology Applications

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Effect of the Substrate Distance on the Microstructure and Properties of SnBi-?Al2O3 Joint Welded by Ultrasonic-assisted Brazing

Authors
Ning Zhang, Haobin Shao, Xiaodong Shi, Chunhong Zhang
Corresponding Author
Ning Zhang
Available Online November 2015.
DOI
10.2991/icmmita-15.2015.211How to use a DOI?
Keywords
SnBi-?Al2O3; substrate distance; ultrasonic-assisted brazing; microstructure
Abstract

New ultrasonic-assisted brazing technology was adopted to weld mini butt joint by SnBi composite solder with 1.5wt% Al2O3 content and 0.5mm, 0.8mm and 1mm three kinds of copper substrate distance. The mechanical properties of the mini butt joint were characterized by means of the micro hardness tester and home-made micro mechanical test system. The microstructure of the samples were observed by scanning electron microscope, and the composition of intermetallic compounds was detected by the energy disperse spectroscopy. The results showed that the ultrasonic-assisted brazing method could promote the expansion of liquid solder on the substrate, improve the wettability, and full of the weld. With the increase of the substrate distance, the alloy microstructure refined, the IMC zone at the interface gradually had a tendency to grow thin, and improved the reliability of the solder joint. Near the composite solder was IMC Cu6Sn5, and the copper substrate was IMC Cu3Sn. Appropriate increase for the substrate distance will contribute to the micro hardness increase.

Copyright
© 2015, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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Volume Title
Proceedings of the 2015 3rd International Conference on Machinery, Materials and Information Technology Applications
Series
Advances in Computer Science Research
Publication Date
November 2015
ISBN
10.2991/icmmita-15.2015.211
ISSN
2352-538X
DOI
10.2991/icmmita-15.2015.211How to use a DOI?
Copyright
© 2015, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

Cite this article

risenwbib
TY  - CONF
AU  - Ning Zhang
AU  - Haobin Shao
AU  - Xiaodong Shi
AU  - Chunhong Zhang
PY  - 2015/11
DA  - 2015/11
TI  - Effect of the Substrate Distance on the Microstructure and Properties of SnBi-?Al2O3 Joint Welded by Ultrasonic-assisted Brazing
BT  - Proceedings of the 2015 3rd International Conference on Machinery, Materials and Information Technology Applications
PB  - Atlantis Press
SP  - 1149
EP  - 1153
SN  - 2352-538X
UR  - https://doi.org/10.2991/icmmita-15.2015.211
DO  - 10.2991/icmmita-15.2015.211
ID  - Zhang2015/11
ER  -