Proceedings of the 2016 4th International Conference on Machinery, Materials and Information Technology Applications

Effect of SiCp(Cu) addition on the property of the SiCp(Cu)/Cu composites

Authors
Peiling Ding, Yunlong Zhang, Ming Hu
Corresponding Author
Peiling Ding
Available Online January 2017.
DOI
https://doi.org/10.2991/icmmita-16.2016.139How to use a DOI?
Keywords
Magnetron sputtering; SiCp(Cu) powder; SiCp(Cu)/Cu composites
Abstract
The continuous copper film on the á-SiC powder was obtained by magnetron sputtering technology. SiCp(Cu)/Cu composites was fabricated by hot-press sintering method. The phase constitution, fracture morphology, relative density, porosity, Vickers hardness of SiCp(Cu)/Cu composites with different SiCp(Cu) addition were analyzed. The results showed that SiCp(Cu) with higher fraction in the SiCp(Cu)/Cu composites decreased relative density and increase porosity, then it also improved Vickers hardness.
Open Access
This is an open access article distributed under the CC BY-NC license.

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Cite this article

TY  - CONF
AU  - Peiling Ding
AU  - Yunlong Zhang
AU  - Ming Hu
PY  - 2017/01
DA  - 2017/01
TI  - Effect of SiCp(Cu) addition on the property of the SiCp(Cu)/Cu composites
BT  - Proceedings of the 2016 4th International Conference on Machinery, Materials and Information Technology Applications
PB  - Atlantis Press
SP  - 748
EP  - 751
SN  - 2352-538X
UR  - https://doi.org/10.2991/icmmita-16.2016.139
DO  - https://doi.org/10.2991/icmmita-16.2016.139
ID  - Ding2017/01
ER  -