Effect of SiCp(Cu) addition on the property of the SiCp(Cu)/Cu composites
Authors
Peiling Ding, Yunlong Zhang, Ming Hu
Corresponding Author
Peiling Ding
Available Online January 2017.
- DOI
- 10.2991/icmmita-16.2016.139How to use a DOI?
- Keywords
- Magnetron sputtering; SiCp(Cu) powder; SiCp(Cu)/Cu composites
- Abstract
The continuous copper film on the á-SiC powder was obtained by magnetron sputtering technology. SiCp(Cu)/Cu composites was fabricated by hot-press sintering method. The phase constitution, fracture morphology, relative density, porosity, Vickers hardness of SiCp(Cu)/Cu composites with different SiCp(Cu) addition were analyzed. The results showed that SiCp(Cu) with higher fraction in the SiCp(Cu)/Cu composites decreased relative density and increase porosity, then it also improved Vickers hardness.
- Copyright
- © 2017, the Authors. Published by Atlantis Press.
- Open Access
- This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).
Cite this article
TY - CONF AU - Peiling Ding AU - Yunlong Zhang AU - Ming Hu PY - 2017/01 DA - 2017/01 TI - Effect of SiCp(Cu) addition on the property of the SiCp(Cu)/Cu composites BT - Proceedings of the 2016 4th International Conference on Machinery, Materials and Information Technology Applications PB - Atlantis Press SP - 748 EP - 751 SN - 2352-538X UR - https://doi.org/10.2991/icmmita-16.2016.139 DO - 10.2991/icmmita-16.2016.139 ID - Ding2017/01 ER -