SIFT-MIC Based Matching Location Algorithm for Wire Bonding
Kong Fanzhi, Xiao Xiao
Available Online November 2013.
- https://doi.org/10.2991/icmt-13.2013.165How to use a DOI?
- Wire bonding • SIFT• MIC • Vector angle method
- Computer vision inspection system is often applied in automatic wire bonding to ensure the location accuracy and speed, while feature selection affects the performance of inspection system. In this paper, a new feature extraction and matching location algorithm based on SIFT-MIC is proposed for wire bonding. The algorithm chooses MIC corners in the neighborhood of SIFT feature points to increase the robustness of feature extraction. Meanwhile, the selection of SIFT-MIC feature points is before the generation of SIFT descriptors, to reduce the computation and improve the efficiency of feature extraction. The vector angle method is chosen to finish the matching location of the eye-point images and images to be matched. Experimental results show that SIFT-MIC algorithm is invariant to translation and rotation, and has high performance in the positioning accuracy and detection efficiency. The proposed algorithm is suitable for MEMS wire bonding images with rich points and lines features.
- Open Access
- This is an open access article distributed under the CC BY-NC license.
Cite this article
TY - CONF AU - Kong Fanzhi AU - Xiao Xiao PY - 2013/11 DA - 2013/11 TI - SIFT-MIC Based Matching Location Algorithm for Wire Bonding BT - 3rd International Conference on Multimedia Technology(ICMT-13) PB - Atlantis Press SN - 1951-6851 UR - https://doi.org/10.2991/icmt-13.2013.165 DO - https://doi.org/10.2991/icmt-13.2013.165 ID - Fanzhi2013/11 ER -