Proceedings of the 2015 2nd International Workshop on Materials Engineering and Computer Sciences

Preparation and Characterization of Microcapsule Filled with Ethyl Phenyl Acetate and Its Self-healing Application

Authors
Wanpeng Ma, Wei Zhang, Yang Zhao, Sijie Wang
Corresponding Author
Wanpeng Ma
Available Online October 2015.
DOI
10.2991/iwmecs-15.2015.157How to use a DOI?
Keywords
Self-healing material, Microcapsule, Solvent, Ethyl phenyl acetate.
Abstract

Inspired by biological systems, self-healing materials were achieved by incorporating microcapsules into matrix. Urea-formaldehyde microcapsules filled with EPA were prepared by in situ polymerization method. Surface morphology, size distribution, chemical structure, and thermal analysis of microcapsules were analyzed. Self-healing composites were prepared by adding microcapsules to epoxy resin. Results show that healing efficiency was dependent on the microcapsule concentration. Fracture toughness could be fully restored when the microcapsule concentration was 10%. Finally, microcapsules can be raptured by crack and solvents were release to crack region confirmed by SEM.

Copyright
© 2015, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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Volume Title
Proceedings of the 2015 2nd International Workshop on Materials Engineering and Computer Sciences
Series
Advances in Computer Science Research
Publication Date
October 2015
ISBN
10.2991/iwmecs-15.2015.157
ISSN
2352-538X
DOI
10.2991/iwmecs-15.2015.157How to use a DOI?
Copyright
© 2015, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

Cite this article

TY  - CONF
AU  - Wanpeng Ma
AU  - Wei Zhang
AU  - Yang Zhao
AU  - Sijie Wang
PY  - 2015/10
DA  - 2015/10
TI  - Preparation and Characterization of Microcapsule Filled with Ethyl Phenyl Acetate and Its Self-healing Application
BT  - Proceedings of the 2015 2nd International Workshop on Materials Engineering and Computer Sciences
PB  - Atlantis Press
SP  - 793
EP  - 796
SN  - 2352-538X
UR  - https://doi.org/10.2991/iwmecs-15.2015.157
DO  - 10.2991/iwmecs-15.2015.157
ID  - Ma2015/10
ER  -