Effect of mechanical attrition on microstructure and property of electroplating of copper plating in acid solution
Changjie Feng, Namei Wu, Shuilian Hu
Available Online April 2015.
- https://doi.org/10.2991/amcce-15.2015.88How to use a DOI?
- Mechanical attrition; Acid copper electroplating; Anti-carburizing
- In this paper, the mechanical attrition(MA) was supplied in a traditional electroplating process by rolling movement of different diameter of glass balls in the acid copper plating electrolyte to study the effects of different diameters of the glass balls on microstructure of copper plating and the properties of carbon-impervious, grain refine and corrosion resistance. The results showed that the grain size of the plating had obviously decreased in the MA process, and with increasing the diameters of the glass balls, the porosity, corrosion resistance and the properties of carbon-impervious of the plating were first increased and then decreased.
- Open Access
- This is an open access article distributed under the CC BY-NC license.
Cite this article
TY - CONF AU - Changjie Feng AU - Namei Wu AU - Shuilian Hu PY - 2015/04 DA - 2015/04 TI - Effect of mechanical attrition on microstructure and property of electroplating of copper plating in acid solution BT - 2015 International Conference on Automation, Mechanical Control and Computational Engineering PB - Atlantis Press SP - 467 EP - 472 SN - 1951-6851 UR - https://doi.org/10.2991/amcce-15.2015.88 DO - https://doi.org/10.2991/amcce-15.2015.88 ID - Feng2015/04 ER -