Proceedings of the 2015 International Conference on Automation, Mechanical Control and Computational Engineering

Effect of mechanical attrition on microstructure and property of electroplating of copper plating in acid solution

Authors
Changjie Feng, Namei Wu, Shuilian Hu
Corresponding Author
Changjie Feng
Available Online April 2015.
DOI
https://doi.org/10.2991/amcce-15.2015.88How to use a DOI?
Keywords
Mechanical attrition; Acid copper electroplating; Anti-carburizing
Abstract
In this paper, the mechanical attrition(MA) was supplied in a traditional electroplating process by rolling movement of different diameter of glass balls in the acid copper plating electrolyte to study the effects of different diameters of the glass balls on microstructure of copper plating and the properties of carbon-impervious, grain refine and corrosion resistance. The results showed that the grain size of the plating had obviously decreased in the MA process, and with increasing the diameters of the glass balls, the porosity, corrosion resistance and the properties of carbon-impervious of the plating were first increased and then decreased.
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Proceedings
2015 International Conference on Automation, Mechanical Control and Computational Engineering
Part of series
Advances in Intelligent Systems Research
Publication Date
April 2015
ISBN
978-94-62520-64-6
ISSN
1951-6851
DOI
https://doi.org/10.2991/amcce-15.2015.88How to use a DOI?
Open Access
This is an open access article distributed under the CC BY-NC license.

Cite this article

TY  - CONF
AU  - Changjie Feng
AU  - Namei Wu
AU  - Shuilian Hu
PY  - 2015/04
DA  - 2015/04
TI  - Effect of mechanical attrition on microstructure and property of electroplating of copper plating in acid solution
BT  - 2015 International Conference on Automation, Mechanical Control and Computational Engineering
PB  - Atlantis Press
SP  - 467
EP  - 472
SN  - 1951-6851
UR  - https://doi.org/10.2991/amcce-15.2015.88
DO  - https://doi.org/10.2991/amcce-15.2015.88
ID  - Feng2015/04
ER  -