Proceedings of the 2015 International Conference on Automation, Mechanical Control and Computational Engineering

Computer Simulation Based on 3D Printer

Authors
Liang Dong
Corresponding Author
Liang Dong
Available Online April 2015.
DOI
https://doi.org/10.2991/amcce-15.2015.127How to use a DOI?
Keywords
3D printing; computer simulation; temperature field; thermodynamics
Abstract
This paper is based on 3D printing technology, as for study and design on those printing tests; it develops a set of 3D printing equipment to make design on head, modelling chamber and temperature system. It simulates temperature field in 3D printing process and provides instruction for 3D printing test to analyse heat stress coupling field. The study results indicate that the higher temperature in head and modelling chamber, the quicker speed pf printing, the higher overall temperature on printing, the smoother of temperature distribution. Modelling chamber temperature and printing speed have stronger effect on model temperature field, while head temperature has little effect.
Open Access
This is an open access article distributed under the CC BY-NC license.

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Proceedings
2015 International Conference on Automation, Mechanical Control and Computational Engineering
Part of series
Advances in Intelligent Systems Research
Publication Date
April 2015
ISBN
978-94-62520-64-6
ISSN
1951-6851
DOI
https://doi.org/10.2991/amcce-15.2015.127How to use a DOI?
Open Access
This is an open access article distributed under the CC BY-NC license.

Cite this article

TY  - CONF
AU  - Liang Dong
PY  - 2015/04
DA  - 2015/04
TI  - Computer Simulation Based on 3D Printer
BT  - 2015 International Conference on Automation, Mechanical Control and Computational Engineering
PB  - Atlantis Press
SN  - 1951-6851
UR  - https://doi.org/10.2991/amcce-15.2015.127
DO  - https://doi.org/10.2991/amcce-15.2015.127
ID  - Dong2015/04
ER  -