Proceedings of the 2015 International Conference on Automation, Mechanical Control and Computational Engineering

A Precise Model of TSV Parasitic Capacitance Considering Temperature for 3D IC

Authors
Quan Deng, Min-Xuan Zhang, Zhen-Yu Zhao, Peng Li
Corresponding Author
Quan Deng
Available Online April 2015.
DOI
https://doi.org/10.2991/amcce-15.2015.306How to use a DOI?
Keywords
3D IC; TSV; Corner; Temperature and Parasitic Capacitance
Abstract
As the technology of three dimension integrated circuit (3D IC) develop quickly, through silicon via (TSV) plays a basic and important role. In consideration of real working environment, factors as temperature and working voltage are studied by TCAD simulator. And the contribution of physical sizes and the concentration of doping in the course are analyzed. A new analysis model of capacitance for TSV is given, which is with an error less than 4% with the measurement data. In the range of 25 to 125 degree centigrade with different physical sizes of TSV, this model of TSV’s parasitic capacitance shows a better accuracy and takes less time than the former one. The neglect of temperature in course of design will lead to a big problem in real chip, an accurate mode considering temperature is important both in design and SI analysis.
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This is an open access article distributed under the CC BY-NC license.

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Proceedings
Part of series
Advances in Intelligent Systems Research
Publication Date
April 2015
ISBN
978-94-62520-64-6
ISSN
1951-6851
DOI
https://doi.org/10.2991/amcce-15.2015.306How to use a DOI?
Open Access
This is an open access article distributed under the CC BY-NC license.

Cite this article

TY  - CONF
AU  - Quan Deng
AU  - Min-Xuan Zhang
AU  - Zhen-Yu Zhao
AU  - Peng Li
PY  - 2015/04
DA  - 2015/04
TI  - A Precise Model of TSV Parasitic Capacitance Considering Temperature for 3D IC
PB  - Atlantis Press
SN  - 1951-6851
UR  - https://doi.org/10.2991/amcce-15.2015.306
DO  - https://doi.org/10.2991/amcce-15.2015.306
ID  - Deng2015/04
ER  -