Proceedings of the 3rd International Conference on Electric and Electronics

The Infrared Multispectral Image Simulation Research Based on 3D Scene

Authors
Bo Li, Huai-ci Zhao, Mei Du, Jinfeng Lv
Corresponding Author
Bo Li
Available Online December 2013.
DOI
10.2991/eeic-13.2013.32How to use a DOI?
Keywords
infrared multispectral simulation, the data cube, self-radiation
Abstract

A method of generating infrared multispectral simulation images by 3D scene is presented. The infrared images at any observation angle of the scene and a data cube of simulation images of specific waveband could be generated by the method. Some experiments have been done in waveband 3~5 m to generate a data cube involving 401 infrared simulation images in the wavelength step 0.005 m, and the experiments results show that the simulation method presented in this paper could generate infrared multispectral images data cube rapidly. A way to reflect the differences while the observation angle changed is mentioned in this paper.

Copyright
© 2013, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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Volume Title
Proceedings of the 3rd International Conference on Electric and Electronics
Series
Advances in Intelligent Systems Research
Publication Date
December 2013
ISBN
10.2991/eeic-13.2013.32
ISSN
1951-6851
DOI
10.2991/eeic-13.2013.32How to use a DOI?
Copyright
© 2013, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

Cite this article

TY  - CONF
AU  - Bo Li
AU  - Huai-ci Zhao
AU  - Mei Du
AU  - Jinfeng Lv
PY  - 2013/12
DA  - 2013/12
TI  - The Infrared Multispectral Image Simulation Research Based on 3D Scene
BT  - Proceedings of the 3rd International Conference on Electric and Electronics
PB  - Atlantis Press
SP  - 137
EP  - 140
SN  - 1951-6851
UR  - https://doi.org/10.2991/eeic-13.2013.32
DO  - 10.2991/eeic-13.2013.32
ID  - Li2013/12
ER  -