Proceedings of the 3rd International Conference on Material, Mechanical and Manufacturing Engineering

The Design Of Multiple Nodes Wireless Temperature Transmission System Based On STC15W1K24S And CC1101

Authors
Zhijian Yin, Wang Fan, Xiang Kun
Corresponding Author
Zhijian Yin
Available Online August 2015.
DOI
10.2991/ic3me-15.2015.155How to use a DOI?
Keywords
CC1101; SPI; Temperature;
Abstract

With the development of science and technology, the wireless transmission system has a broad application field. This system need to collect the temperature data of two nodes. So we use the new single chip microcomputer STC15W1K24S as microprocessor, DS18B20 as temperature sensor, low power consumption wireless radio frequency transceiver CC1101 to transmit data collected from the two channels, and LCD1602 to display data. The single chip microcomputer has SPI interface, it can improve the efficiency of data transmission and has better real-time, when using its own SPI interface to communicate with CC1101. This system is battery-powered, it has small volume, low power consumption, high precision and easy to carry.

Copyright
© 2015, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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Volume Title
Proceedings of the 3rd International Conference on Material, Mechanical and Manufacturing Engineering
Series
Advances in Engineering Research
Publication Date
August 2015
ISBN
10.2991/ic3me-15.2015.155
ISSN
2352-5401
DOI
10.2991/ic3me-15.2015.155How to use a DOI?
Copyright
© 2015, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

Cite this article

TY  - CONF
AU  - Zhijian Yin
AU  - Wang Fan
AU  - Xiang Kun
PY  - 2015/08
DA  - 2015/08
TI  - The Design Of Multiple Nodes Wireless Temperature Transmission System Based On STC15W1K24S And CC1101
BT  - Proceedings of the 3rd International Conference on Material, Mechanical and Manufacturing Engineering
PB  - Atlantis Press
SP  - 808
EP  - 812
SN  - 2352-5401
UR  - https://doi.org/10.2991/ic3me-15.2015.155
DO  - 10.2991/ic3me-15.2015.155
ID  - Yin2015/08
ER  -