Proceedings of the 5th International Conference on Advanced Design and Manufacturing Engineering

Research on Small-scale Variable Capacity Evaporative Cooling Plate System for Chips with High Heating Flux

Authors
Tao Wang, Fang Wang, Hongqun Chen, Junyan Ou, Dawei Yu, Jiawen Zhang
Corresponding Author
Tao Wang
Available Online October 2015.
DOI
https://doi.org/10.2991/icadme-15.2015.407How to use a DOI?
Keywords
high heating flux, chip, variable capacity, evaporative cooling plate
Abstract

This paper aims to research and analyze the heat dispersion of small variable capacity refrigeration system which is used for cooling the chips with high heating flux. The cooling system was built for researching what influence refrigerant charge will bring to the performance of the system, such as suction-exhaust pressure and temperature as well as refrigerating capacity of the system. Simulation experiment has been established to contrast the performances of system with evaporative cooling plate and water-cooled cooling plate respectively. The result shows it takes less time to make the temperature of the chip stable with the former system. Moreover, the temperature can keep at a lower level.

Copyright
© 2015, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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Volume Title
Proceedings of the 5th International Conference on Advanced Design and Manufacturing Engineering
Series
Advances in Engineering Research
Publication Date
October 2015
ISBN
978-94-6252-113-1
ISSN
2352-5401
DOI
https://doi.org/10.2991/icadme-15.2015.407How to use a DOI?
Copyright
© 2015, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

Cite this article

TY  - CONF
AU  - Tao Wang
AU  - Fang Wang
AU  - Hongqun Chen
AU  - Junyan Ou
AU  - Dawei Yu
AU  - Jiawen Zhang
PY  - 2015/10
DA  - 2015/10
TI  - Research on Small-scale Variable Capacity Evaporative Cooling Plate System for Chips with High Heating Flux
BT  - Proceedings of the 5th International Conference on Advanced Design and Manufacturing Engineering
PB  - Atlantis Press
SP  - 2186
EP  - 2190
SN  - 2352-5401
UR  - https://doi.org/10.2991/icadme-15.2015.407
DO  - https://doi.org/10.2991/icadme-15.2015.407
ID  - Wang2015/10
ER  -