Proceedings of the 2nd International Conference on Computer Science and Electronics Engineering (ICCSEE 2013)

Machining Precision Research for Two WEDM Processes

Authors
Xiaojing Li, Yanhui Hu
Corresponding Author
Xiaojing Li
Available Online March 2013.
DOI
10.2991/iccsee.2013.545How to use a DOI?
Keywords
component, WEDM, Positional precision, Finished accuracy
Abstract

Plenty of round holes or especial holes distributed in measuring device and mold component with higher positional requirement, in general, are formed in WEDM technology. In the process of WEDM operation, whole holes with high requirement should be finished in one time, which can avoid of positional error and enhance the positional precision effectively. Investigate into the geometrical tolerance and present in an improved process. This process can both suitable for WEDM-HS and WEDM-LS.

Copyright
© 2013, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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Volume Title
Proceedings of the 2nd International Conference on Computer Science and Electronics Engineering (ICCSEE 2013)
Series
Advances in Intelligent Systems Research
Publication Date
March 2013
ISBN
978-90-78677-61-1
ISSN
1951-6851
DOI
10.2991/iccsee.2013.545How to use a DOI?
Copyright
© 2013, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

Cite this article

TY  - CONF
AU  - Xiaojing Li
AU  - Yanhui Hu
PY  - 2013/03
DA  - 2013/03
TI  - Machining Precision Research for Two WEDM Processes
BT  - Proceedings of the 2nd International Conference on Computer Science and Electronics Engineering (ICCSEE 2013)
PB  - Atlantis Press
SP  - 2169
EP  - 2172
SN  - 1951-6851
UR  - https://doi.org/10.2991/iccsee.2013.545
DO  - 10.2991/iccsee.2013.545
ID  - Li2013/03
ER  -