Filling Rate Analysis for EMC Module of Smartphone’s Battery Using Automated Design System

DOI

10.2991/icitmi-15.2015.53How to use a DOI?

Keywords

Filling Ratio, Automated Design System, Epoxy Molding Compound, Protection Module Package, Mesh Generation

Abstract

Recently, the use of smartphones are growing rapidly and increasing discomfort due to shortages of the battery capacity. Also, consumers are often dissatisfied with the battery life from even the most advanced lithium-ion rechargeable batteries in mobile phone. This paper describes finite element analysis simulation of filling rate for epoxy molding compound module of battery using automated design system. It is considered that if this result is conducted with additional research, it will be possible to plan a better process design.

Copyright

© 2015, the Authors. Published by Atlantis Press.

Open Access

This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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TY  - CONF
AU  - Joon-Seong Lee
PY  - 2015/10
DA  - 2015/10
TI  - Filling Rate Analysis for EMC Module of Smartphone’s Battery Using Automated Design System
BT  - Proceedings of the 4th International Conference on Information Technology and Management Innovation
PB  - Atlantis Press
SP  - 317
EP  - 323
SN  - 2352-538X
UR  - https://doi.org/10.2991/icitmi-15.2015.53
DO  - 10.2991/icitmi-15.2015.53
ID  - Lee2015/10
ER  -