Proceedings of the 2016 5th International Conference on Measurement, Instrumentation and Automation (ICMIA 2016)

The Reliability Model on the Burned Failure of Molded Case Circuit

Authors
Yang Xue, Yangchun Cheng, Penghe Zhang, Yinghui Xu, Baoliang Zhang, Dezhi Xiong, Zhengzhou Dou, Wenwen Li
Corresponding Author
Yang Xue
Available Online November 2016.
DOI
10.2991/icmia-16.2016.132How to use a DOI?
Keywords
Molded case circuit breaker; burned failure; reliability; aging test.
Abstract

Low voltage molded case circuit breaker is widely used in the low voltage distribution system of customers. Along with the revolution of the electric power grid, Low voltage molded case circuit breaker in resident house takes more important intelligent function except of its traditional function. In the recent standards, it is lack of the items about the reliability of the wire terminal of the breaker. But according to the results of the survey to the failure of LVMCB, the burned failure has great percentage. In this paper, the main mechanism of the burned failure of the terminal is researched, which is described as the loss of heat balance. Based on this mechanism, the reliability model focused on the burned failure is established, in which the random on the quality of the breaker, the random on the load of the breaker, and the characteristic degradation of the breaker are considered. The probability density distribution function, heat balance equation and iteration calculation are used to calculate the reliability. Finally, the accelerated aging methods and parameters, such as high temperature aging and its test temperature, high current aging and its current and duration time, are induced to carry out the reliability test.

Copyright
© 2016, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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Volume Title
Proceedings of the 2016 5th International Conference on Measurement, Instrumentation and Automation (ICMIA 2016)
Series
Advances in Intelligent Systems Research
Publication Date
November 2016
ISBN
10.2991/icmia-16.2016.132
ISSN
1951-6851
DOI
10.2991/icmia-16.2016.132How to use a DOI?
Copyright
© 2016, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

Cite this article

TY  - CONF
AU  - Yang Xue
AU  - Yangchun Cheng
AU  - Penghe Zhang
AU  - Yinghui Xu
AU  - Baoliang Zhang
AU  - Dezhi Xiong
AU  - Zhengzhou Dou
AU  - Wenwen Li
PY  - 2016/11
DA  - 2016/11
TI  - The Reliability Model on the Burned Failure of Molded Case Circuit
BT  - Proceedings of the 2016 5th International Conference on Measurement, Instrumentation and Automation (ICMIA 2016)
PB  - Atlantis Press
SN  - 1951-6851
UR  - https://doi.org/10.2991/icmia-16.2016.132
DO  - 10.2991/icmia-16.2016.132
ID  - Xue2016/11
ER  -