Proceedings of the 4th International Conference on Mechatronics, Materials, Chemistry and Computer Engineering 2015

The physical property of epoxy/graphene nanoplatelets composites prepared by ball milling

Authors
Danqing Chen, Jie Yan
Corresponding Author
Danqing Chen
Available Online December 2015.
DOI
10.2991/icmmcce-15.2015.296How to use a DOI?
Keywords
Epoxy; Graphene Nanoplatelets; Ball Milling; thermal conductivity
Abstract

Epoxy/graphene nanoplatelets(EP/GNs) composite was prepared by ball milling(BM), using diglycidyl ether of bisphenol A(DGEBA)as matrix, Diethyltoluene diamine(DETDA) as curing agent, GNs as thermal conductive filler. The mechanisms and influence of different BM time to exfoliate layered GNs and compound with Epoxy resin were investigated. The morphology, thermal conductivity of EP/GNs composite were investigated too. It showed that BM was an effective method to prepare EP/GNs conductive composite of low loading level by avoiding aggregation of GNs.

Copyright
© 2015, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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Volume Title
Proceedings of the 4th International Conference on Mechatronics, Materials, Chemistry and Computer Engineering 2015
Series
Advances in Computer Science Research
Publication Date
December 2015
ISBN
978-94-6252-133-9
ISSN
2352-538X
DOI
10.2991/icmmcce-15.2015.296How to use a DOI?
Copyright
© 2015, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

Cite this article

TY  - CONF
AU  - Danqing Chen
AU  - Jie Yan
PY  - 2015/12
DA  - 2015/12
TI  - The physical property of epoxy/graphene nanoplatelets composites prepared by ball milling
BT  - Proceedings of the 4th International Conference on Mechatronics, Materials, Chemistry and Computer Engineering 2015
PB  - Atlantis Press
SN  - 2352-538X
UR  - https://doi.org/10.2991/icmmcce-15.2015.296
DO  - 10.2991/icmmcce-15.2015.296
ID  - Chen2015/12
ER  -