Effect of aging mode on the IMC growth of SAC(305)/Cu solder joints during aging

DOI

10.2991/icmse-18.2018.46How to use a DOI?

Keywords

Sn-3.0Ag-0.5Cu solder, aging mode, intermetallic compound, thickness

Abstract

Two different aging modes of continuous aging and interval aging were adopted to investigate the intermetallic compound (IMC) growth between Sn-3.0Ag-0.5Cu (SAC(305) )solder and Cu substrate. The morphologies of IMC layer are different during two different aging modes, and there is only one phase(Cu6Sn5 phase) form during interval aging. Despite the different morphologies, the growth of IMC layers both follow diffusion control mode during two different aging styles, and the growth rate of IMC layer is slowlier over interval aging than that over continuous aging. In addition, it is illuminated the phenomenon of no Cu3Sn form during interval aging, this can be mainly explained by interval aging mode and diffusion growth mode, the free energy of system is not high enough to overcome the kinetic energy barrier and make the Cu6Sn5 phase change into Cu3Sn. In a word, the reliability of SAC(305)/Cu solder joints can be improved during interval aging.

Copyright

© 2018, the Authors. Published by Atlantis Press.

Open Access

This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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TY  - CONF
AU  - Min Qu
AU  - Tianze Cao
AU  - Yan Cui
AU  - Fengbin Liu
AU  - Zhiwei Jiao
AU  - Yuan Liu
PY  - 2018/05
DA  - 2018/05
TI  - Effect of aging mode on the IMC growth of SAC(305)/Cu solder joints during aging
BT  - Proceedings of the 2018 8th International Conference on Manufacturing Science and Engineering (ICMSE 2018)
PB  - Atlantis Press
SP  - 231
EP  - 235
SN  - 2352-5401
UR  - https://doi.org/10.2991/icmse-18.2018.46
DO  - 10.2991/icmse-18.2018.46
ID  - Qu2018/05
ER  -