Proceedings of the 2023 4th International Conference on Management Science and Engineering Management (ICMSEM 2023)

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How to Improve the Resilience of Supply Chain of China’s Semiconductor Industry Under Trade War

Authors
Shiping Cao1, Jian Wang1, *
1School of Management, Harbin Institute of Technology, Harbin, 150000, China
*Corresponding author. Email: kkwang_jian@outlook.com
Corresponding Author
Jian Wang
Available Online 9 October 2023.
DOI
10.2991/978-94-6463-256-9_88How to use a DOI?
Keywords
semiconductor; supply chain resilience; trade war; disruption risk; grey correlation method
Abstract

Semiconductor industry is one of the most important indicators to gauge a nation’s scientific and technological strength and economic development. Under the context of China-US trade war, the China’s semiconductor supply chain is facing with severe disruption risks. This paper analyses the internal and external environment where China’s semiconductor supply chain is situated, and studies the relevant important influential factors for supply chain resilience. A new systematic evaluation method is proposed to quantitatively analyze the resilience of China’s semiconductor supply chain by establishing an index evaluation system using the degree of exposure, sensitivity, and ability to recovery as the three main measurements. Through the improved grey correlation method, the correlation degree is employed as the index to express the influence of these three factors on the resilience of semiconductor’s supply chain. As a result, the overall resilience of China’s semiconductor supply chain is evaluated as relatively low degree, especially in the segments of key SME, EDA software and talent pool building. To deal with the foreign monopoly in these segments, some policy implications is raised like releasing government initiatives from downstream supply chain, fostering important technologies in a competitive market, and improving talent training system, innovative management system and mechanism.

Copyright
© 2024 The Author(s)
Open Access
Open Access This chapter is licensed under the terms of the Creative Commons Attribution-NonCommercial 4.0 International License (http://creativecommons.org/licenses/by-nc/4.0/), which permits any noncommercial use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license and indicate if changes were made.

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Volume Title
Proceedings of the 2023 4th International Conference on Management Science and Engineering Management (ICMSEM 2023)
Series
Advances in Economics, Business and Management Research
Publication Date
9 October 2023
ISBN
10.2991/978-94-6463-256-9_88
ISSN
2352-5428
DOI
10.2991/978-94-6463-256-9_88How to use a DOI?
Copyright
© 2024 The Author(s)
Open Access
Open Access This chapter is licensed under the terms of the Creative Commons Attribution-NonCommercial 4.0 International License (http://creativecommons.org/licenses/by-nc/4.0/), which permits any noncommercial use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license and indicate if changes were made.

Cite this article

risenwbib
TY  - CONF
AU  - Shiping Cao
AU  - Jian Wang
PY  - 2023
DA  - 2023/10/09
TI  - How to Improve the Resilience of Supply Chain of China’s Semiconductor Industry Under Trade War
BT  - Proceedings of the 2023 4th International Conference on Management Science and Engineering Management (ICMSEM 2023)
PB  - Atlantis Press
SP  - 884
EP  - 899
SN  - 2352-5428
UR  - https://doi.org/10.2991/978-94-6463-256-9_88
DO  - 10.2991/978-94-6463-256-9_88
ID  - Cao2023
ER  -