Proceedings of the 2017 2nd International Symposium on Advances in Electrical, Electronics and Computer Engineering (ISAEECE 2017)

Optimization Analysis of Mobile Phone Shell Based on Moldflow

Authors
Baofu Sun, Mingjiang Hu, Haixiong Wang
Corresponding Author
Baofu Sun
Available Online March 2017.
DOI
10.2991/isaeece-17.2017.81How to use a DOI?
Keywords
mobile phone shell; moldflow; Taguchi; optimizing design
Abstract

For simple plastic injection parts of mobile phone shell, in order to reduce the warp of the injection molding and the number of test mold in design process, this paper takes a mobile phone shell for example as the analysis object, using SolidWorks software to address the Three-dimensional modeling of the mobile phone shell and moldflow software to analyze the warp defects of product .By the way of taking the method of Taguchi experiment, optimizing mold structure, filling pressure and sizing pressure curve,the warp of the injection molding could be reduced. So we can get a better combination data of process and reduce the cost of mold-design and manufacturing.

Copyright
© 2017, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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Volume Title
Proceedings of the 2017 2nd International Symposium on Advances in Electrical, Electronics and Computer Engineering (ISAEECE 2017)
Series
Advances in Engineering Research
Publication Date
March 2017
ISBN
10.2991/isaeece-17.2017.81
ISSN
2352-5401
DOI
10.2991/isaeece-17.2017.81How to use a DOI?
Copyright
© 2017, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

Cite this article

TY  - CONF
AU  - Baofu Sun
AU  - Mingjiang Hu
AU  - Haixiong Wang
PY  - 2017/03
DA  - 2017/03
TI  - Optimization Analysis of Mobile Phone Shell Based on Moldflow
BT  - Proceedings of the 2017 2nd International Symposium on Advances in Electrical, Electronics and Computer Engineering (ISAEECE 2017)
PB  - Atlantis Press
SP  - 423
EP  - 426
SN  - 2352-5401
UR  - https://doi.org/10.2991/isaeece-17.2017.81
DO  - 10.2991/isaeece-17.2017.81
ID  - Sun2017/03
ER  -