Design and development of composite anodic bonding system based on dielectric barrier discharge method

DOI

10.2991/lemcs-14.2014.159How to use a DOI?

Keywords

DBD; anodic bonding; plasma; surface treatment; gas discharge

Abstract

In this paper, a composite anodic bonding system is developed. In order to reduce the temperature of anodic bonding, DBD(Dielectric barrier discharge)plasma treatment is used. The process of composite anodic bonding is described. The effects and mechanism of the DBD plasma on bond quality are investigated. The functional of composite anodic bonding system is determined. The composite bonding system can be modular constructed by the power supply module, temperature module, motion operation module, visual detection module. When the temperature is 300 ,the DBD Voltage is 1200v, frequency is 20KHz, interspace is 2 mm, glow-like plasmas is generated at atmospheric pressure, and bonding quality is best. DBD treatment can reduce the bonding temperature is proved through experiment.

Copyright

© 2014, the Authors. Published by Atlantis Press.

Open Access

This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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TY  - CONF
AU  - Xufeng Zhao
AU  - Mingqiang Pan
AU  - Chunyi Lu
AU  - Liguo Chen
PY  - 2014/05
DA  - 2014/05
TI  - Design and development of composite anodic bonding system based on dielectric barrier discharge method
BT  - Proceedings of the International Conference on Logistics, Engineering, Management and Computer Science
PB  - Atlantis Press
SP  - 696
EP  - 700
SN  - 1951-6851
UR  - https://doi.org/10.2991/lemcs-14.2014.159
DO  - 10.2991/lemcs-14.2014.159
ID  - Zhao2014/05
ER  -