Thermal Structure Coupling Analysis of Friction Pair of Electronic Limited Slip Differential

DOI

10.2991/masta-19.2019.29How to use a DOI?

Keywords

Electronic limited slip differential, Friction pair, ANSYS analysis, Thermal stress, Deformation

Abstract

In order to study the deformation mechanism of the friction pair of electronic limited slip differential, a coupled thermal-structural mathematical model of the friction pair is established. The temperature and stress field distribution of the friction pair are obtained by finite element method. This article analyzes the distribution characteristics of temperature and stress field, and obtains the relationship between temperature and pressure change of contact surface. The results show that under the differential starting condition, the temperature rise is obvious, and the steel disk has the possibility of warping deformation. In the future, during the optimal design of electronic limited slip differential, it can provides a reliable theoretical basis for the design of friction pairs.

Copyright

© 2019, the Authors. Published by Atlantis Press.

Open Access

This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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TY  - CONF
AU  - Wei-jia Chen
AU  - Jun Xiao
AU  - Zhi-zhu Liu
AU  - Chao Xiao
PY  - 2019/07
DA  - 2019/07
TI  - Thermal Structure Coupling Analysis of Friction Pair of Electronic Limited Slip Differential
BT  - Proceedings of the 2019 International Conference on Modeling, Analysis, Simulation Technologies and Applications (MASTA 2019)
PB  - Atlantis Press
SP  - 171
EP  - 175
SN  - 1951-6851
UR  - https://doi.org/10.2991/masta-19.2019.29
DO  - 10.2991/masta-19.2019.29
ID  - Chen2019/07
ER  -