Research on Reliability Prediction of Power Management Module

DOI

10.2991/mcei-16.2016.301How to use a DOI?

Keywords

Reliability prediction; The component count method; The stress analysis method; The power Management module

Abstract

As an important part of the reliability design, the reliability prediction of electronic products reflects the reliability level of electronic components and the whole system. By analysis the structure and function model of a power Management module, this paper separately applies the component count method and the stress analysis method to predict its reliability according to the military standard GJB/Z99C 2006. The analysis results indicate that the component count method is suitable for the preliminary design phase of product due to its simplicity and less time consuming. Furthermore, the stress analysis method is better to be applied in the detailed design phase of product due to its complexity and more time consuming.

Copyright

© 2017, the Authors. Published by Atlantis Press.

Open Access

This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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TY  - CONF
AU  - Shuai Han
AU  - Feng Ding
PY  - 2016/12
DA  - 2016/12
TI  - Research on Reliability Prediction of Power Management Module
BT  - Proceedings of the 2016 6th International Conference on Mechatronics, Computer and Education Informationization (MCEI 2016)
PB  - Atlantis Press
SP  - 1482
EP  - 1486
SN  - 1951-6851
UR  - https://doi.org/10.2991/mcei-16.2016.301
DO  - 10.2991/mcei-16.2016.301
ID  - Han2016/12
ER  -