Research on Reliability Prediction of Power Management Module
Shuai Han, Feng Ding
Available Online December 2016.
- https://doi.org/10.2991/mcei-16.2016.301How to use a DOI?
- Reliability prediction; The component count method; The stress analysis method; The power Management module
- As an important part of the reliability design, the reliability prediction of electronic products reflects the reliability level of electronic components and the whole system. By analysis the structure and function model of a power Management module, this paper separately applies the component count method and the stress analysis method to predict its reliability according to the military standard GJB/Z99C 2006. The analysis results indicate that the component count method is suitable for the preliminary design phase of product due to its simplicity and less time consuming. Furthermore, the stress analysis method is better to be applied in the detailed design phase of product due to its complexity and more time consuming.
- Open Access
- This is an open access article distributed under the CC BY-NC license.
Cite this article
TY - CONF AU - Shuai Han AU - Feng Ding PY - 2016/12 DA - 2016/12 TI - Research on Reliability Prediction of Power Management Module BT - 2016 6th International Conference on Mechatronics, Computer and Education Informationization (MCEI 2016) PB - Atlantis Press SN - 1951-6851 UR - https://doi.org/10.2991/mcei-16.2016.301 DO - https://doi.org/10.2991/mcei-16.2016.301 ID - Han2016/12 ER -