Proceedings of the 2015 International Conference on Materials, Environmental and Biological Engineering

Impact of the Content of LaNd on Physical Properties of Zn9.3Al7Cu Solder

Authors
Shitao Ma, Yanfu Yan, Jinhong Zhu
Corresponding Author
Shitao Ma
Available Online April 2015.
DOI
10.2991/mebe-15.2015.128How to use a DOI?
Keywords
Zn9.3Al7Cu solder; RE LaNd; density; conductivity.
Abstract

In the paper a new solder is made by adding trace LaNd into Zn9.3Al7Cu alloy to improve the performance through alloying principle. The impact of the content of LaNd on physical properties of Zn9.3Al7Cu solder is investigated. Results show that the density of solder alloys increases with the increasing of the content of rare earth LaNd, When RE content is 0.5wt.%,the Zn9.3Al7Cu0.5RE has the greatest density, is 6.29 g/cm3 which is about 1.73% bigger than the matrix solder; Adding rare earth LaNd has a great influence on the resistivity of solder alloy, the resistivity of solder alloys increases with the increasing of the content of rare earth LaNd, the resistivity reaches the greatest value When RE LaNd content is 0.5wt.%,he greatest value is 0.2×10-6 m which is about 11% bigger than the matrix solder.

Copyright
© 2015, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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Volume Title
Proceedings of the 2015 International Conference on Materials, Environmental and Biological Engineering
Series
Advances in Engineering Research
Publication Date
April 2015
ISBN
10.2991/mebe-15.2015.128
ISSN
2352-5401
DOI
10.2991/mebe-15.2015.128How to use a DOI?
Copyright
© 2015, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

Cite this article

TY  - CONF
AU  - Shitao Ma
AU  - Yanfu Yan
AU  - Jinhong Zhu
PY  - 2015/04
DA  - 2015/04
TI  - Impact of the Content of LaNd on Physical Properties of Zn9.3Al7Cu Solder
BT  - Proceedings of the 2015 International Conference on Materials, Environmental and Biological Engineering
PB  - Atlantis Press
SP  - 557
EP  - 560
SN  - 2352-5401
UR  - https://doi.org/10.2991/mebe-15.2015.128
DO  - 10.2991/mebe-15.2015.128
ID  - Ma2015/04
ER  -