Proceedings of the 2017 2nd International Conference on Machinery, Electronics and Control Simulation (MECS 2017)

Further research on the coupled Influence of Temperature and Stress Field to PCB' Modal

Authors
Qin Luo, Ke Yao, Chuangmian Huang
Corresponding Author
Qin Luo
Available Online June 2016.
DOI
https://doi.org/10.2991/mecs-17.2017.40How to use a DOI?
Keywords
coupled influence, temperature field, stress field, PCB's modal.
Abstract
The coupling analysis of temperature and vibration has been an important branch of domestic and international research. Influence of Temperature and Stress Field to PCB' Modal has been described in previous articles [1]. In this paper, vibration stress analysis method based on ANSYS considering temperature field and thermal stress field is introduced. Further research on the coupled influence of temperature and stress field to PCB' modal is analyzed. And the temperature field, stress field and the coupled Influence on PCB's modal were compared, which provide a reference for the PCB design and modal analysis in the future.
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Volume Title
Proceedings of the 2017 2nd International Conference on Machinery, Electronics and Control Simulation (MECS 2017)
Series
Advances in Engineering Research
Publication Date
June 2016
ISBN
978-94-6252-352-4
ISSN
2352-5401
DOI
https://doi.org/10.2991/mecs-17.2017.40How to use a DOI?
Open Access
This is an open access article distributed under the CC BY-NC license.

Cite this article

TY  - CONF
AU  - Qin Luo
AU  - Ke Yao
AU  - Chuangmian Huang
PY  - 2016/06
DA  - 2016/06
TI  - Further research on the coupled Influence of Temperature and Stress Field to PCB' Modal
BT  - Proceedings of the 2017 2nd International Conference on Machinery, Electronics and Control Simulation (MECS 2017)
PB  - Atlantis Press
SN  - 2352-5401
UR  - https://doi.org/10.2991/mecs-17.2017.40
DO  - https://doi.org/10.2991/mecs-17.2017.40
ID  - Luo2016/06
ER  -