Further research on the coupled Influence of Temperature and Stress Field to PCB' Modal
Qin Luo, Ke Yao, Chuangmian Huang
Available Online June 2016.
- https://doi.org/10.2991/mecs-17.2017.40How to use a DOI?
- coupled influence, temperature field, stress field, PCB's modal.
- The coupling analysis of temperature and vibration has been an important branch of domestic and international research. Influence of Temperature and Stress Field to PCB' Modal has been described in previous articles . In this paper, vibration stress analysis method based on ANSYS considering temperature field and thermal stress field is introduced. Further research on the coupled influence of temperature and stress field to PCB' modal is analyzed. And the temperature field, stress field and the coupled Influence on PCB's modal were compared, which provide a reference for the PCB design and modal analysis in the future.
- Open Access
- This is an open access article distributed under the CC BY-NC license.
Cite this article
TY - CONF AU - Qin Luo AU - Ke Yao AU - Chuangmian Huang PY - 2016/06 DA - 2016/06 TI - Further research on the coupled Influence of Temperature and Stress Field to PCB' Modal BT - Proceedings of the 2017 2nd International Conference on Machinery, Electronics and Control Simulation (MECS 2017) PB - Atlantis Press SN - 2352-5401 UR - https://doi.org/10.2991/mecs-17.2017.40 DO - https://doi.org/10.2991/mecs-17.2017.40 ID - Luo2016/06 ER -