A Novel High Power LED Module Design on Aluminum Board (COAB) by Packaging Multi-Die in both Series and Parallel

DOI

10.2991/meici-16.2016.129How to use a DOI?

Keywords

LED; Junction temperature; Heat dissipation; Chip on aluminum board (COAB)

Abstract

To decrease the LED operating temperature this paper presents a novel high power LED COAB (Chip on Aluminum Board) bonding method, the heat dissipation performance was studied by packaging the multi-die in the combination of series and parallel. The trade-off parameters were the bonding distance and driving voltage. The dies were connected in a combination of 3 dies in series and 3 sets in parallel (3x3 square matrix pattern). If the separation distance of die bonding was 1.5mm, the temperatures on the top surface of center LED with driving voltage of 8 (9) Volts was 75.2 (90.5) . On the other hand, if the separation distance reduced to 1.0mm with the driving voltage of 8 (9) Volts, then the temperatures at the top surface of center LED would be increased to 75.7 (115.2) . Thus for the LEDs efficiency kept at 80% of those at 25 , the final choice of die bonding distance and driving voltage were 1.0mm and 8V, respectively.

Copyright

© 2016, the Authors. Published by Atlantis Press.

Open Access

This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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TY  - CONF
AU  - Jiumming Lin
AU  - ChengHung Lin
PY  - 2016/09
DA  - 2016/09
TI  - A Novel High Power LED Module Design on Aluminum Board (COAB) by Packaging Multi-Die in both Series and Parallel
BT  - Proceedings of the 2016 6th International Conference on Management, Education, Information and Control (MEICI 2016)
PB  - Atlantis Press
SP  - 620
EP  - 624
SN  - 1951-6851
UR  - https://doi.org/10.2991/meici-16.2016.129
DO  - 10.2991/meici-16.2016.129
ID  - Lin2016/09
ER  -