The Study of Injection Compression Molding of Thin-wall Light-guide Plates with Hemispherical Micro structures
Qi Chuan-zhen, Wang Yong-tao, Zhuang Jian, Zhang Ya-jun
Available Online December 2012.
- https://doi.org/10.2991/mems.2012.71How to use a DOI?
- ICM; Warpage; Light-guide Plates; Orthogonal Method; Parameters
- Light-guide plate (LGP) is a key component of back-light modules in liquid crystal displays; warpage is one of the factors that affect the quality of LGP. Orthogonal simulation and experiment are used in this paper to study the effect of the injection compression molding (ICM) parameters, such as the melt temperature, injection speed, mold temperature, compression distance, and compression speed. Both the simulation and experiment show that the most important factor that affects the products’ warpage is melt temperature. And the effect order of the parameters from the simulation analysis is melt temperature, injection speed, mold temperature, compression distance, compression speed, and the effect order from the experiment analysis is same to the simulation analysis. So the experiment results prove the simulation results.
- Open Access
- This is an open access article distributed under the CC BY-NC license.
Cite this article
TY - CONF AU - Qi Chuan-zhen AU - Wang Yong-tao AU - Zhuang Jian AU - Zhang Ya-jun PY - 2012/12 DA - 2012/12 TI - The Study of Injection Compression Molding of Thin-wall Light-guide Plates with Hemispherical Micro structures BT - Proceedings of the 1st International Conference on Mechanical Engineering and Material Science (MEMS 2012) PB - Atlantis Press SP - 263 EP - 266 SN - 1951-6851 UR - https://doi.org/10.2991/mems.2012.71 DO - https://doi.org/10.2991/mems.2012.71 ID - Chuan-zhen2012/12 ER -