Proceedings of the 1st International Conference on Mechanical Engineering and Material Science (MEMS 2012)

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The Design of high Power LED Chip Radiator

Authors
Wang Jingyi, Li Ruitao, He Liyan
Corresponding Author
Wang Jingyi
Available Online December 2012.
DOI
10.2991/mems.2012.134How to use a DOI?
Keywords
LED; Heat sink.
Abstract

The LED node temperature rises with the increasing of power and it leads to sharp attenuation LED’s life, according to these characteristics, combining active and passive cooling methods to design a new type of heat sink. The maximum temperature of LED is controlled in 43 C . At last a heat analysis is done by ICEPAK.

Copyright
© 2012, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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Volume Title
Proceedings of the 1st International Conference on Mechanical Engineering and Material Science (MEMS 2012)
Series
Advances in Intelligent Systems Research
Publication Date
December 2012
ISBN
10.2991/mems.2012.134
ISSN
1951-6851
DOI
10.2991/mems.2012.134How to use a DOI?
Copyright
© 2012, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

Cite this article

risenwbib
TY  - CONF
AU  - Wang Jingyi
AU  - Li Ruitao
AU  - He Liyan
PY  - 2012/12
DA  - 2012/12
TI  - The Design of high Power LED Chip Radiator
BT  - Proceedings of the 1st International Conference on Mechanical Engineering and Material Science (MEMS 2012)
PB  - Atlantis Press
SP  - 509
EP  - 511
SN  - 1951-6851
UR  - https://doi.org/10.2991/mems.2012.134
DO  - 10.2991/mems.2012.134
ID  - Jingyi2012/12
ER  -