Simulation Analysis and Study of Comprehensive Stress Change Regularity In the Sintering Process of LTCC Microwave Component

DOI

10.2991/mmeceb-15.2016.19How to use a DOI?

Keywords

LTCC microwave component, sintering, technological parameter, comprehensive stress

Abstract

LTCC microwave component has small spacing between lines, the tiny deformation in sintering will affect the mechanical properties of components seriously. This paper established a 3D finite element simulation analysis model of the LTCC microwave component with micro-channels by using the software ABAQUS, due to the higher requirements of temperature control in the process of sintering, here simulated the sintering process by the choice of three process parameters like heating rate, holding time and cooling rate which had a greater influence on sintering shrinkage. About the LTCC component of microwave, the research had shown that in the phase of sintering densification, cooling rate is the most significant the influence on comprehensive stress, substrate contracts much more severely when there is a faster cooling rate, it causes local stress concentration, deformation, and even cracking; A faster heating rate will produce more liquid phase, pores can't discharge, affecting the densification of the component; reasonable extension of the holding time can promote the sintering process, but a too long holding time will aggravate the secondary recrystallization, then the densification will be inadequate along with the deformation. A set of reasonable sintering process parameters is obtained by simulation analysis: the heating rate is 6 /min, the holding time 12min, the cooling rate is 9 /min, which can avoid the stress concentration phenomenon effectively, and improve the mechanical performance of the components.

Copyright

© 2016, the Authors. Published by Atlantis Press.

Open Access

This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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TY  - CONF
AU  - Benye Yin
AU  - Zhaohua Wu
PY  - 2015/12
DA  - 2015/12
TI  - Simulation Analysis and Study of Comprehensive Stress Change Regularity In the Sintering Process of LTCC Microwave Component
BT  - Proceedings of the 2015 2nd International Conference on Machinery, Materials Engineering, Chemical Engineering and Biotechnology
PB  - Atlantis Press
SP  - 90
EP  - 94
SN  - 2352-5401
UR  - https://doi.org/10.2991/mmeceb-15.2016.19
DO  - 10.2991/mmeceb-15.2016.19
ID  - Yin2015/12
ER  -