Proceedings of the 2017 2nd International Conference on Modelling, Simulation and Applied Mathematics (MSAM2017)

Numerical Simulation and Characteristics Test of Temperature Field under Short-circuit Fault

Authors
Ying Wu
Corresponding Author
Ying Wu
Available Online March 2017.
DOI
https://doi.org/10.2991/msam-17.2017.20How to use a DOI?
Keywords
simulation; short-circuit fault; temperature field
Abstract
In this article, finite element software ANSYS was used to simulate the temperature field of short-circuit fault on copper conducting wire. A third-dimensional thermoelectric coupling model was established after analyzing the principle of short-circuit fault. The problem of latent heat was solved by the enthalpy method. The paper simulated the changes of temperature field, so as to get vaporization volume of copper wires and calculate the splash of energy during transient short circuit, which are the most elements affecting on the splashing energy.
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Proceedings
2017 2nd International Conference on Modelling, Simulation and Applied Mathematics (MSAM2017)
Part of series
Advances in Intelligent Systems Research
Publication Date
March 2017
ISBN
978-94-6252-324-1
ISSN
1951-6851
DOI
https://doi.org/10.2991/msam-17.2017.20How to use a DOI?
Open Access
This is an open access article distributed under the CC BY-NC license.

Cite this article

TY  - CONF
AU  - Ying Wu
PY  - 2017/03
DA  - 2017/03
TI  - Numerical Simulation and Characteristics Test of Temperature Field under Short-circuit Fault
BT  - 2017 2nd International Conference on Modelling, Simulation and Applied Mathematics (MSAM2017)
PB  - Atlantis Press
SP  - 83
EP  - 86
SN  - 1951-6851
UR  - https://doi.org/10.2991/msam-17.2017.20
DO  - https://doi.org/10.2991/msam-17.2017.20
ID  - Wu2017/03
ER  -