Numerical Simulation and Characteristics Test of Temperature Field under Short-circuit Fault

DOI

10.2991/msam-17.2017.20How to use a DOI?

Keywords

simulation; short-circuit fault; temperature field

Abstract

In this article, finite element software ANSYS was used to simulate the temperature field of short-circuit fault on copper conducting wire. A third-dimensional thermoelectric coupling model was established after analyzing the principle of short-circuit fault. The problem of latent heat was solved by the enthalpy method. The paper simulated the changes of temperature field, so as to get vaporization volume of copper wires and calculate the splash of energy during transient short circuit, which are the most elements affecting on the splashing energy.

Copyright

© 2017, the Authors. Published by Atlantis Press.

Open Access

This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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TY  - CONF
AU  - Ying Wu
PY  - 2017/03
DA  - 2017/03
TI  - Numerical Simulation and Characteristics Test of Temperature Field under Short-circuit Fault
BT  - Proceedings of the 2017 2nd International Conference on Modelling, Simulation and Applied Mathematics (MSAM2017)
PB  - Atlantis Press
SP  - 83
EP  - 86
SN  - 1951-6851
UR  - https://doi.org/10.2991/msam-17.2017.20
DO  - 10.2991/msam-17.2017.20
ID  - Wu2017/03
ER  -