Numerical Simulation and Characteristics Test of Temperature Field under Short-circuit Fault
Available Online March 2017.
- https://doi.org/10.2991/msam-17.2017.20How to use a DOI?
- simulation; short-circuit fault; temperature field
- In this article, finite element software ANSYS was used to simulate the temperature field of short-circuit fault on copper conducting wire. A third-dimensional thermoelectric coupling model was established after analyzing the principle of short-circuit fault. The problem of latent heat was solved by the enthalpy method. The paper simulated the changes of temperature field, so as to get vaporization volume of copper wires and calculate the splash of energy during transient short circuit, which are the most elements affecting on the splashing energy.
- Open Access
- This is an open access article distributed under the CC BY-NC license.
Cite this article
TY - CONF AU - Ying Wu PY - 2017/03 DA - 2017/03 TI - Numerical Simulation and Characteristics Test of Temperature Field under Short-circuit Fault BT - 2017 2nd International Conference on Modelling, Simulation and Applied Mathematics (MSAM2017) PB - Atlantis Press SP - 83 EP - 86 SN - 1951-6851 UR - https://doi.org/10.2991/msam-17.2017.20 DO - https://doi.org/10.2991/msam-17.2017.20 ID - Wu2017/03 ER -