Proceedings of the 2018 3rd International Conference on Automation, Mechanical Control and Computational Engineering (AMCCE 2018)

Growth behavior of IMCs layer between Sn-3.0Ag-0.5Cu solder and Cu substrate during aging

Authors
Min Qu, Tianze Cao, Yan Cui, Fengbin Liu, Zhiwei Jiao
Corresponding Author
Min Qu
Available Online May 2018.
DOI
https://doi.org/10.2991/amcce-18.2018.53How to use a DOI?
Keywords
Intermetallic compounds, Sn-3.0Ag-0.5Cu solder, Aging, Thickness
Abstract
Growth behavior of intermetallic compounds (IMCs) layer between Sn-3.0Ag-0.5Cu solder and Cu substrate were studied during aging at 150 ?"? for 1 day, 3 days, 6 days, 8 days and 10 days, respectively. Results shows that the IMCs layer is scallop shape at aging stage, and the aspect ratio of scallop shape decreases with time increasing. Moreover, the IMCs layer grows thicker with extended aging time. Furthermore, the IMCs layer grows linearly with square root of aging time, and the growth kinetic equation of Sn-3.0Ag-0.5Cu/Cu solder joints is obtained by linear fit, which is X = 1.94 +1.95t1/2. Finally, the diffusion coefficient D is verified as 3.8025μm2/d.
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Proceedings
2018 3rd International Conference on Automation, Mechanical Control and Computational Engineering (AMCCE 2018)
Part of series
Advances in Engineering Research
Publication Date
May 2018
ISBN
978-94-6252-508-5
ISSN
2352-5401
DOI
https://doi.org/10.2991/amcce-18.2018.53How to use a DOI?
Open Access
This is an open access article distributed under the CC BY-NC license.

Cite this article

TY  - CONF
AU  - Min Qu
AU  - Tianze Cao
AU  - Yan Cui
AU  - Fengbin Liu
AU  - Zhiwei Jiao
PY  - 2018/05
DA  - 2018/05
TI  - Growth behavior of IMCs layer between Sn-3.0Ag-0.5Cu solder and Cu substrate during aging
BT  - 2018 3rd International Conference on Automation, Mechanical Control and Computational Engineering (AMCCE 2018)
PB  - Atlantis Press
SN  - 2352-5401
UR  - https://doi.org/10.2991/amcce-18.2018.53
DO  - https://doi.org/10.2991/amcce-18.2018.53
ID  - Qu2018/05
ER  -