Proceedings of the 2015 Asia-Pacific Energy Equipment Engineering Research Conference

Effect of Curing Temperature and Curing Degree on Elastic Recovery of Conductive Particles

Authors
Min Gong, Dejian Zhou
Corresponding Author
Min Gong
Available Online June 2015.
DOI
10.2991/ap3er-15.2015.43How to use a DOI?
Keywords
the radio frequency (RF) function layer; elastic recover of conductive particles; finite element modeling (FEM); anisotropic conductive adhesive (ACA); phenomenological model
Abstract

The nonlinear properties of elastic modulus of the resin in relation to curing degree of the resin was defined through the phenomenological model. The finite element model of LTCC-metal assembly, which belong to the radio frequency (RF) function layer, is established by ABAQUS. When curing pressure is determined, the effect of different curing degree on the elastic recover of conductive particles is given under the same curing temperature, and the influence of different curing temperature on the deformation of conductive particle is also given under the same curing degree. Therefore, the curing degree increased is able to increase the contact area of conductive particles so as to reduce the contact resistance, but at the same time, the interconnection interface residual stress also increased, thus easy to cause the stratification. However, when the curing degree is determined, the contact area increased firstly, and then gradually decrease as the curing temperature increases, and when used in curing at lower temperature, the curing time increased accordingly, it will influence the economic benefits.

Copyright
© 2015, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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Volume Title
Proceedings of the 2015 Asia-Pacific Energy Equipment Engineering Research Conference
Series
Advances in Engineering Research
Publication Date
June 2015
ISBN
10.2991/ap3er-15.2015.43
ISSN
2352-5401
DOI
10.2991/ap3er-15.2015.43How to use a DOI?
Copyright
© 2015, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

Cite this article

TY  - CONF
AU  - Min Gong
AU  - Dejian Zhou
PY  - 2015/06
DA  - 2015/06
TI  - Effect of Curing Temperature and Curing Degree on Elastic Recovery of Conductive Particles
BT  - Proceedings of the 2015 Asia-Pacific Energy Equipment Engineering Research Conference
PB  - Atlantis Press
SP  - 182
EP  - 185
SN  - 2352-5401
UR  - https://doi.org/10.2991/ap3er-15.2015.43
DO  - 10.2991/ap3er-15.2015.43
ID  - Gong2015/06
ER  -