Study on preparing single–component flow–type EP underfill adhesive
- 10.2991/asei-15.2015.390How to use a DOI?
- epoxy, conductive adhesive, electronics, dicyandiamide(DCA), thermal conductivity
With EP(epoxy resin) as matrix resin, DCA(dicyandiamide) as curing agent and modified imidazole as curing accelerator, and adding fillers and other additives, a single–component flow–type EP underfill adhesive was prepared. The curing temperature was determined by testing gelation time and characterizing FT-IR(infrared spectroscopy). And the influences of fillers types and proportions on the viscosity, thermal conductivity, dielectric constant and bonding strength of adhesives were discussed. The research results indicated that the adhesive had good combination property and could fully meet the application requirements. when mass ratios of m(EP):m(DCA):m(modified imidazole) was 100:8:5, w(filler)was 60% in EP and m(Al2O3):m(SiO2) was 1:5, and mass fractions of silane coupling agent and dispersing agent were all 0.5% in EP, and curing process was “85°C/30min 120°C/1h”(cured for 30 minutes at 85°C, and cured for 1h at 120°C), Its shear strength was 15.33 MPa, thermal conductivity was 0.793 W/(m.K), and viscosity was 6.06 Pa.S.
- © 2015, the Authors. Published by Atlantis Press.
- Open Access
- This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).
Cite this article
TY - CONF AU - Huilu Li AU - Hongli Wei AU - Kangchen Shao AU - Ting Zhang PY - 2015/05 DA - 2015/05 TI - Study on preparing single–component flow–type EP underfill adhesive BT - Proceedings of the 2015 International conference on Applied Science and Engineering Innovation PB - Atlantis Press SP - 1976 EP - 1980 SN - 2352-5401 UR - https://doi.org/10.2991/asei-15.2015.390 DO - 10.2991/asei-15.2015.390 ID - Li2015/05 ER -