Crack Tip Fields for Anti-plane Interfacial Crack between Functionally Graded and Homogeneous Piezoelectric Materials
Xiao Chong, Yao Dai, Guixiang Hao, Zhiqiang Zhang
Available Online August 2015.
- https://doi.org/10.2991/ic3me-15.2015.336How to use a DOI?
- crack tip fields, piezoelectric materials, interfacial crack, weak-discontinuity.
- The problem of an anti-plane crack situated in the interface of functionally graded piezoelectric materials (FGPMs) and homogeneous piezoelectric materials (HPMs) is considered under the impermeable assumption of crack surfaces. The mechanical and electrical properties of the FGPMs are assumed to be power functions of y perpendicular to the crack. The higher order crack tip stress and electric displacement fields for FGPMs and HPMs are obtained by the eigen-expansion method. The stress intensity factor and electric displacement intensity factor are obtained explicitly.
- Open Access
- This is an open access article distributed under the CC BY-NC license.
Cite this article
TY - CONF AU - Xiao Chong AU - Yao Dai AU - Guixiang Hao AU - Zhiqiang Zhang PY - 2015/08 DA - 2015/08 TI - Crack Tip Fields for Anti-plane Interfacial Crack between Functionally Graded and Homogeneous Piezoelectric Materials BT - 3rd International Conference on Material, Mechanical and Manufacturing Engineering (IC3ME 2015) PB - Atlantis Press SN - 2352-5401 UR - https://doi.org/10.2991/ic3me-15.2015.336 DO - https://doi.org/10.2991/ic3me-15.2015.336 ID - Chong2015/08 ER -