Proceedings of the 3rd International Conference on Material, Mechanical and Manufacturing Engineering

Crack Tip Fields for Anti-plane Interfacial Crack between Functionally Graded and Homogeneous Piezoelectric Materials

Authors
Xiao Chong, Yao Dai, Guixiang Hao, Zhiqiang Zhang
Corresponding Author
Xiao Chong
Available Online August 2015.
DOI
https://doi.org/10.2991/ic3me-15.2015.336How to use a DOI?
Keywords
crack tip fields, piezoelectric materials, interfacial crack, weak-discontinuity.
Abstract
The problem of an anti-plane crack situated in the interface of functionally graded piezoelectric materials (FGPMs) and homogeneous piezoelectric materials (HPMs) is considered under the impermeable assumption of crack surfaces. The mechanical and electrical properties of the FGPMs are assumed to be power functions of y perpendicular to the crack. The higher order crack tip stress and electric displacement fields for FGPMs and HPMs are obtained by the eigen-expansion method. The stress intensity factor and electric displacement intensity factor are obtained explicitly.
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This is an open access article distributed under the CC BY-NC license.

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Proceedings
3rd International Conference on Material, Mechanical and Manufacturing Engineering (IC3ME 2015)
Part of series
Advances in Engineering Research
Publication Date
August 2015
ISBN
978-94-6252-100-1
ISSN
2352-5401
DOI
https://doi.org/10.2991/ic3me-15.2015.336How to use a DOI?
Open Access
This is an open access article distributed under the CC BY-NC license.

Cite this article

TY  - CONF
AU  - Xiao Chong
AU  - Yao Dai
AU  - Guixiang Hao
AU  - Zhiqiang Zhang
PY  - 2015/08
DA  - 2015/08
TI  - Crack Tip Fields for Anti-plane Interfacial Crack between Functionally Graded and Homogeneous Piezoelectric Materials
BT  - 3rd International Conference on Material, Mechanical and Manufacturing Engineering (IC3ME 2015)
PB  - Atlantis Press
SN  - 2352-5401
UR  - https://doi.org/10.2991/ic3me-15.2015.336
DO  - https://doi.org/10.2991/ic3me-15.2015.336
ID  - Chong2015/08
ER  -