Research on Curing Mechanism of Bisphenol-A Epoxy Resin by DSC

DOI

10.2991/icaees-15.2015.52How to use a DOI?

Keywords

DSC curve; bisphenol-A epoxy resin; amine curing agent; reaction mechanism

Abstract

Curing reaction of bisphenol-A epoxy resin were researched by non-isothermal DSC. The experiment result showed that the cured structure were excellent when the proportion between the bisphenol-A epoxy resin DER331 and curing agent DEH622 was 100:30, the reaction heat was 358.53 J/g which is 4 to 9 times higher than the heat released by other different ratios. Initial curing temperature was 36.35°C which is the lowest among all different ratios, curing peak temperature was lower 10°C to 40°C than other proportion. Thus, optimum proportion between the DER331 epoxy resin and the DEH622 curing agent is 100:30.

Copyright

© 2015, the Authors. Published by Atlantis Press.

Open Access

This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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TY  - CONF
AU  - Juan Zhao
AU  - Guang Ye Liu
PY  - 2015/07
DA  - 2015/07
TI  - Research on Curing Mechanism of Bisphenol-A Epoxy Resin by DSC
BT  - Proceedings of the 3rd International Conference on Advances in Energy and Environmental Science 2015
PB  - Atlantis Press
SP  - 276
EP  - 279
SN  - 2352-5401
UR  - https://doi.org/10.2991/icaees-15.2015.52
DO  - 10.2991/icaees-15.2015.52
ID  - Zhao2015/07
ER  -