Research on Curing Mechanism of Bisphenol-A Epoxy Resin by DSC
- 10.2991/icaees-15.2015.52How to use a DOI?
- DSC curve; bisphenol-A epoxy resin; amine curing agent; reaction mechanism
Curing reaction of bisphenol-A epoxy resin were researched by non-isothermal DSC. The experiment result showed that the cured structure were excellent when the proportion between the bisphenol-A epoxy resin DER331 and curing agent DEH622 was 100:30, the reaction heat was 358.53 J/g which is 4 to 9 times higher than the heat released by other different ratios. Initial curing temperature was 36.35°C which is the lowest among all different ratios, curing peak temperature was lower 10°C to 40°C than other proportion. Thus, optimum proportion between the DER331 epoxy resin and the DEH622 curing agent is 100:30.
- © 2015, the Authors. Published by Atlantis Press.
- Open Access
- This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).
Cite this article
TY - CONF AU - Juan Zhao AU - Guang Ye Liu PY - 2015/07 DA - 2015/07 TI - Research on Curing Mechanism of Bisphenol-A Epoxy Resin by DSC BT - Proceedings of the 3rd International Conference on Advances in Energy and Environmental Science 2015 PB - Atlantis Press SP - 276 EP - 279 SN - 2352-5401 UR - https://doi.org/10.2991/icaees-15.2015.52 DO - 10.2991/icaees-15.2015.52 ID - Zhao2015/07 ER -