Multi-Layer Linkage Sealing Mechanism on Solar Cell Tool
Authors
Huaxin Yang, Yuehui Hu, Yichuan Chen
Corresponding Author
Huaxin Yang
Available Online November 2015.
- DOI
- 10.2991/icectt-15.2015.24How to use a DOI?
- Keywords
- Multi-linkage, mechanism, Dynamic Sealing, Leak Rate
- Abstract
The PECVD (Plasma Enhanced Chemical Vapor Deposition) process chamber is dynamic sealed by the Multi-layer Linkage Sealing Mechanism, which is installed in front of process boxes. The leak rate attach uniformity requirement of process gas and RF flow distribution. Meanwhile, The efficiency of aSi/uc tandem thin-film solar cell, which is produced by this tool, is higher than 12 on 1.43 m2.
- Copyright
- © 2015, the Authors. Published by Atlantis Press.
- Open Access
- This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).
Cite this article
TY - CONF AU - Huaxin Yang AU - Yuehui Hu AU - Yichuan Chen PY - 2015/11 DA - 2015/11 TI - Multi-Layer Linkage Sealing Mechanism on Solar Cell Tool BT - Proceedings of the 2015 International Conference on Electromechanical Control Technology and Transportation PB - Atlantis Press SP - 125 EP - 129 SN - 2352-5401 UR - https://doi.org/10.2991/icectt-15.2015.24 DO - 10.2991/icectt-15.2015.24 ID - Yang2015/11 ER -