Multi-Layer Linkage Sealing Mechanism on Solar Cell Tool

DOI

10.2991/icectt-15.2015.24How to use a DOI?

Keywords

Multi-linkage, mechanism, Dynamic Sealing, Leak Rate

Abstract

The PECVD (Plasma Enhanced Chemical Vapor Deposition) process chamber is dynamic sealed by the Multi-layer Linkage Sealing Mechanism, which is installed in front of process boxes. The leak rate attach uniformity requirement of process gas and RF flow distribution. Meanwhile, The efficiency of aSi/uc tandem thin-film solar cell, which is produced by this tool, is higher than 12 on 1.43 m2.

Copyright

© 2015, the Authors. Published by Atlantis Press.

Open Access

This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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TY  - CONF
AU  - Huaxin Yang
AU  - Yuehui Hu
AU  - Yichuan Chen
PY  - 2015/11
DA  - 2015/11
TI  - Multi-Layer Linkage Sealing Mechanism on Solar Cell Tool
BT  - Proceedings of the 2015 International Conference on Electromechanical Control Technology and Transportation
PB  - Atlantis Press
SP  - 125
EP  - 129
SN  - 2352-5401
UR  - https://doi.org/10.2991/icectt-15.2015.24
DO  - 10.2991/icectt-15.2015.24
ID  - Yang2015/11
ER  -