Thermoelectric Cooler Failure Prevention Caused Due to CTE Mismatch by FEA Based Solder Layer Material Selection

DOI

10.2991/978-94-6463-252-1_122How to use a DOI?

Keywords

Peltier effect; CTE; TEC; Solder material; Thermal shock

Abstract

Thermoelectric coolers (TEC) work on the principle of Peltier effect and are widely used in semiconductor industry to cool the components placed inside packages. The present work examines the effect of coefficient of thermal expansion (CTE) on the strength of solder joints of TEC. Due to difference in the CTE’s of TEC materials, uneven expansion and contraction of solder layers occurs leading to high stress levels in n-p semiconductors. Two solder layers are used in TEC to attach ceramic plate to heat sink at hot and cold sides. Finite element analysis (FEA) is performed for different solder materials to investigate the failure of n-p semiconductors. This allows selecting the most appropriate material to improve the design of TEC and thus prevent failure. To prevent dependency on single source and supplier, three different materials are analyzed namely Indium (In99.9), Indium Bismuth (In-50Bi) and Tin Bismuth (Sn42Bi58). Based on performance criteria, two of them are shortlisted with an aim to improve the TEC design. Solder junctions between ceramic plate and heatsink are important to connect both the parts. CTE mismatch between solder layers causes high stress in n-p semiconductor, leading to TEC failure. FEA analysis performed under thermal shock load over 0–125 C helps in selecting the better solder material to reduce the testing time with improved TEC design.

Copyright

© 2023 The Author(s)

Open Access

Open Access This chapter is licensed under the terms of the Creative Commons Attribution-NonCommercial 4.0 International License (http://creativecommons.org/licenses/by-nc/4.0/), which permits any noncommercial use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license and indicate if changes were made.

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TY  - CONF
AU  - Akshat Sankhere
AU  - David Faller
AU  - Kishore Palaparthi
PY  - 2023
DA  - 2023/11/09
TI  - Thermoelectric Cooler Failure Prevention Caused Due to CTE Mismatch by FEA Based Solder Layer Material Selection
BT  - Proceedings of the Second International Conference on Emerging Trends in Engineering (ICETE 2023)
PB  - Atlantis Press
SP  - 1218
EP  - 1225
SN  - 2352-5401
UR  - https://doi.org/10.2991/978-94-6463-252-1_122
DO  - 10.2991/978-94-6463-252-1_122
ID  - Sankhere2023
ER  -