Proceedings of the 2016 4th International Conference on Machinery, Materials and Computing Technology

Crack extension research of FR4 substrate embedded 90°bend optical fiber under the random vibration

Authors
Wei Li, Dejian Zhou
Corresponding Author
Wei Li
Available Online March 2016.
DOI
https://doi.org/10.2991/icmmct-16.2016.112How to use a DOI?
Keywords
OPCB; J integral; Crack expand; Random vibration
Abstract
For the reliability problem of the 90 ° bend optical fiber embedded FR4 substrate in the bad service environment especially for military, the easily failure area of this modal under environments of random vibration and characteristics of interface cracks extending are researched. Firstly, modal analysis is conducted by ANSYS, to confirm the factors affecting the natural frequency of the base board, and to find the natural frequency in the status of the minimum bending loss. Combined with Military standard electronic products environmental stress screening method (GJB1032-90), the random vibration tests are conducted. Then, the stress distribution is treated as boundary conditions to calculate J integral. Ultimately, the results of calculating shows that under frequency between 440.45 and 440.45Hz, the minimum bending loss model prone to resonance; when the crack length is greater than 0.094mm, crack began to expand, and lead to low stress brittle fracture; crack growth and the J integral are linear positive correlation, so was the crack growth rate and the KI.
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Volume Title
Proceedings of the 2016 4th International Conference on Machinery, Materials and Computing Technology
Series
Advances in Engineering Research
Publication Date
March 2016
ISBN
978-94-6252-165-0
ISSN
2352-5401
DOI
https://doi.org/10.2991/icmmct-16.2016.112How to use a DOI?
Open Access
This is an open access article distributed under the CC BY-NC license.

Cite this article

TY  - CONF
AU  - Wei Li
AU  - Dejian Zhou
PY  - 2016/03
DA  - 2016/03
TI  - Crack extension research of FR4 substrate embedded 90°bend optical fiber under the random vibration
BT  - Proceedings of the 2016 4th International Conference on Machinery, Materials and Computing Technology
PB  - Atlantis Press
SP  - 556
EP  - 560
SN  - 2352-5401
UR  - https://doi.org/10.2991/icmmct-16.2016.112
DO  - https://doi.org/10.2991/icmmct-16.2016.112
ID  - Li2016/03
ER  -