Proceedings of the AASRI International Conference on Industrial Electronics and Applications (2015)

Rapid Solidification Characteristics of Highly Undercooled Liquid Ni-Cu-Mo-Ge Quaternary Alloy under Electromagnetic Levitation Condition

Authors
Chang Jian, Wang Haipeng, Wei Bingbo
Corresponding Author
Chang Jian
Available Online September 2015.
DOI
https://doi.org/10.2991/iea-15.2015.7How to use a DOI?
Keywords
dendritic growth; high undercooling; solute trapping.
Abstract

The dendritic growth characteristics of undercooled liquid Ni-5%Cu-5%Mo-5%Ge quaternary alloy were investigated by electromagnetic levitation method. The measured dendritic growth velocity of -Ni phase increases with undercooling according to a power law relation, which attains a value of 28 m/s at the maximum undercooling of 321 K (0.19TL). The microstructure morphology appears as coarse dendrites at small undercoolings, while it is refined into equiaxed grains at substantial undercoolings. Furthermore, all the solute elements Cu, Mo and Ge exhibit a significant solute trapping effect during rapid dendritic growth.

Copyright
© 2015, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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Volume Title
Proceedings of the AASRI International Conference on Industrial Electronics and Applications (2015)
Series
Advances in Engineering Research
Publication Date
September 2015
ISBN
978-94-62520-65-3
ISSN
2352-5401
DOI
https://doi.org/10.2991/iea-15.2015.7How to use a DOI?
Copyright
© 2015, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

Cite this article

TY  - CONF
AU  - Chang Jian
AU  - Wang Haipeng
AU  - Wei Bingbo
PY  - 2015/09
DA  - 2015/09
TI  - Rapid Solidification Characteristics of Highly Undercooled Liquid Ni-Cu-Mo-Ge Quaternary Alloy under Electromagnetic Levitation Condition
BT  - Proceedings of the AASRI International Conference on Industrial Electronics and Applications (2015)
PB  - Atlantis Press
SP  - 22
EP  - 25
SN  - 2352-5401
UR  - https://doi.org/10.2991/iea-15.2015.7
DO  - https://doi.org/10.2991/iea-15.2015.7
ID  - Jian2015/09
ER  -