A Kind of Microchannel Heat Sink Optimization for High Power Chips Based on CFD and Non-Silicon MEMS Technology

DOI

10.2991/isaeece-16.2016.14How to use a DOI?

Keywords

micro channel, heat sink, pin-fins, optimized

Abstract

A kind of distributed array structure micro channel heat sink is studied in this paper. The fluid height and the ratio between fluid and channel are optimized by computational fluid dynamics (CFD) thermal-mechanical coupling method. The typical heat sink is fabricated by UV-LIGA and non-silicon MEMS technology. The heat sink provides high performance of heat transfer capabilities with single inlet and outlet. The system is heated from top baseplate made of AlN, deionized water as a coolant and copper as the bottom baseplate. The best performance heat sink microchannel has a 300um square pin-fins and 200um fluid channel with a 500um gap height. The finally measurement shows that the heat sink that optimized can keep the chip below 56.3 when heat flux is 243.81W/cm2 , working fluid and environment is 20 and a ratio of pumping power to heat rate of 0.18%.

Copyright

© 2016, the Authors. Published by Atlantis Press.

Open Access

This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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TY  - CONF
AU  - Dawei Yang
AU  - Yan Wang
AU  - Guifu Ding
AU  - Zhiyu Jin
PY  - 2016/04
DA  - 2016/04
TI  - A Kind of Microchannel Heat Sink Optimization for High Power Chips Based on CFD and Non-Silicon MEMS Technology
BT  - Proceedings of the 2016 International Symposium on Advances in Electrical, Electronics and Computer Engineering
PB  - Atlantis Press
SP  - 64
EP  - 67
SN  - 2352-5401
UR  - https://doi.org/10.2991/isaeece-16.2016.14
DO  - 10.2991/isaeece-16.2016.14
ID  - Yang2016/04
ER  -