Proceedings of the 2015 International Conference on Industrial Technology and Management Science

A review on copper recovery from waste PCBs

Authors
A.M. Ji, H.Y. Liu, Z.H. Hu
Corresponding Author
A.M. Ji
Available Online November 2015.
DOI
https://doi.org/10.2991/itms-15.2015.376How to use a DOI?
Keywords
waste PCBs; pretreatment; copper recovery; treatment processes
Abstract
Copper content is higher than other metal in the waste printed circuit boards (PCBs), therefore, recycling of copper from PCBs is an important subject not only from the treatment of E-waste but also from the recovery of valuable materials. This article reviews the latest papers on copper recycle processes from waste PCBs developed from laboratories to pilot engineering applications in the latest 5 years. The recovery processes developed from hydrometallurgy, biometallurgy, supercritical fluid, and mechanical-physical are presented. To achieve the higher quality copper from waste PCBs, deep mechanical-physical pretreatment combined with favorable next refine technology should be utilized in a row. All the technologies are tardily developing based on the previous achievement. It is helpful to technology progress of the recourses recovering from PCBs.
Open Access
This is an open access article distributed under the CC BY-NC license.

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Proceedings
2015 International Conference on Industrial Technology and Management Science
Part of series
Advances in Computer Science Research
Publication Date
November 2015
ISBN
978-94-6252-123-0
ISSN
2352-538X
DOI
https://doi.org/10.2991/itms-15.2015.376How to use a DOI?
Open Access
This is an open access article distributed under the CC BY-NC license.

Cite this article

TY  - CONF
AU  - A.M. Ji
AU  - H.Y. Liu
AU  - Z.H. Hu
PY  - 2015/11
DA  - 2015/11
TI  - A review on copper recovery from waste PCBs
BT  - 2015 International Conference on Industrial Technology and Management Science
PB  - Atlantis Press
SN  - 2352-538X
UR  - https://doi.org/10.2991/itms-15.2015.376
DO  - https://doi.org/10.2991/itms-15.2015.376
ID  - Ji2015/11
ER  -