Interface bonding performance of CuW alloy coating on Cu substrate
Authors
Jiliang Zhang, Fei Wang, Jie Yan, Yonghua Gu, Kaiyong Jiang
Corresponding Author
Jiliang Zhang
Available Online April 2015.
- DOI
- 10.2991/mebe-15.2015.27How to use a DOI?
- Keywords
- CuW Coatings; Cu substrate; Microwave sintering; Interface; Wedged load test
- Abstract
In this paper, CuW alloy is successfully coated on copper substrate by microwave sintering. A wedged load test and scanning electronic microscopy (SEM) are employed to investigate the interface bonding performance. The results show that the CuW coating bonds firmly to the copper substrate without any gap or crack. The interface bonding strength increases with the temperature increase, but doesn’t show an obvious regularity changing with holding time increase.
- Copyright
- © 2015, the Authors. Published by Atlantis Press.
- Open Access
- This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).
Cite this article
TY - CONF AU - Jiliang Zhang AU - Fei Wang AU - Jie Yan AU - Yonghua Gu AU - Kaiyong Jiang PY - 2015/04 DA - 2015/04 TI - Interface bonding performance of CuW alloy coating on Cu substrate BT - Proceedings of the 2015 International Conference on Materials, Environmental and Biological Engineering PB - Atlantis Press SP - 111 EP - 114 SN - 2352-5401 UR - https://doi.org/10.2991/mebe-15.2015.27 DO - 10.2991/mebe-15.2015.27 ID - Zhang2015/04 ER -