Proceedings of the 2014 International Conference on Mechatronics, Electronic, Industrial and Control Engineering

Research of Laser Cladding on Mold Copper Plate Surface

Authors
Wei Fu, Qilin Deng, Peng Cao, Dianbing Chen
Corresponding Author
Wei Fu
Available Online November 2014.
DOI
https://doi.org/10.2991/meic-14.2014.199How to use a DOI?
Keywords
laser cladding; Mold Copper Plate; Ni-based alloy; Ni-based alloy;Co-based alloy
Abstract

Adopting laser cladding technology, 3 kinds of alloy powder (Ni, Fe, Co) is successfully cladded on the surface of mold copper plate. Metallurgical bonding between cladding layer and Cu substrate is generated. Cladding layer has fine grained structure without micro-crack and bubble. The average hardness of Ni-based cladding layer is 672.3HV0.5, which is 6.5 times of the average hardness of Cu substrate. The major constituent phases of Ni-based cladding layer are -Ni austenite phase, CrB compound phase, M7C3 and M23C6 carbonization phase, and Ni3Si phase. The average hardness Fe-based cladding layer is 502.5 HV0.5, which is about 5.5 times of the average hardness of Cu substrate. Co-based cladding layer has higher hardness than Ni-based and Fe-based. The average hardness Co-based cladding layer is 810 HV0.5, which is about 7.2 times of the average hardness of Cu substrate. The main composition of cladding layer is Co, Cr and a bit of Ni, Fe, W. The major constituent phases of cladding layer are -Co austenite phase, (Fe, Ni) solid solution phase, CrCo compound phase, CoCx and Cr7C3 carbonization phase, and Mn3Co7 phase.

Copyright
© 2014, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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Volume Title
Proceedings of the 2014 International Conference on Mechatronics, Electronic, Industrial and Control Engineering
Series
Advances in Engineering Research
Publication Date
November 2014
ISBN
978-94-62520-42-4
ISSN
2352-5401
DOI
https://doi.org/10.2991/meic-14.2014.199How to use a DOI?
Copyright
© 2014, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

Cite this article

TY  - CONF
AU  - Wei Fu
AU  - Qilin Deng
AU  - Peng Cao
AU  - Dianbing Chen
PY  - 2014/11
DA  - 2014/11
TI  - Research of Laser Cladding on Mold Copper Plate Surface
BT  - Proceedings of the 2014 International Conference on Mechatronics, Electronic, Industrial and Control Engineering
PB  - Atlantis Press
SP  - 890
EP  - 894
SN  - 2352-5401
UR  - https://doi.org/10.2991/meic-14.2014.199
DO  - https://doi.org/10.2991/meic-14.2014.199
ID  - Fu2014/11
ER  -