Proceedings of the 2022 International Conference on Science and Technology Ethics and Human Future (STEHF 2022)

Material Preference Analysis of Highly Thermally Conductive Flexible Substrates Based on Material Ethics

Authors
Gaonaonao Xue1, *
1Harbin Institute of Technology (Weihai), Weihai, Shandong Province, China, 264200
*Corresponding author. Email: E-mail: NaonaoIcey@163.com
Corresponding Author
Gaonaonao Xue
Available Online 4 July 2022.
DOI
10.2991/assehr.k.220701.003How to use a DOI?
Keywords
engineering ethics; graphene; high thermal conductivity; flexibility
Abstract

With the development of space technology and the civil economy, society is placing higher demands on flexible substrates. In this paper, from the perspective of material ethics in engineering design, the idea of engineering ethics is implemented in material preferences and green material practices are observed in the experimental process. The most suitable materials for making high thermal conductivity flexible substrates were identified through experimental analysis and comparison, and preliminary samples of high thermal conductivity flexible substrates were finally produced. This paper demonstrates the importance of material ethics in engineering design and can effectively address the negative effects of material mixing, while exploiting the flexibility and thermal conductivity of graphene-based polyimide. It was concluded that rGO is the most suitable raw material for highly thermally conductive flexible substrates, and the process was chosen to make sandwich samples of graphene and polyimide by hot pressing technology.

Copyright
© 2022 The Authors. Published by Atlantis Press SARL.
Open Access
This is an open access article distributed under the CC BY-NC 4.0 license.

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Volume Title
Proceedings of the 2022 International Conference on Science and Technology Ethics and Human Future (STEHF 2022)
Series
Advances in Social Science, Education and Humanities Research
Publication Date
4 July 2022
ISBN
10.2991/assehr.k.220701.003
ISSN
2352-5398
DOI
10.2991/assehr.k.220701.003How to use a DOI?
Copyright
© 2022 The Authors. Published by Atlantis Press SARL.
Open Access
This is an open access article distributed under the CC BY-NC 4.0 license.

Cite this article

TY  - CONF
AU  - Gaonaonao Xue
PY  - 2022
DA  - 2022/07/04
TI  - Material Preference Analysis of Highly Thermally Conductive Flexible Substrates Based on Material Ethics
BT  - Proceedings of the 2022 International Conference on Science and Technology Ethics and Human Future (STEHF 2022)
PB  - Atlantis Press
SP  - 8
EP  - 13
SN  - 2352-5398
UR  - https://doi.org/10.2991/assehr.k.220701.003
DO  - 10.2991/assehr.k.220701.003
ID  - Xue2022
ER  -