International Journal of Computational Intelligence Systems

Volume 7, Issue sup2, July 2014, Pages 66 - 73

A virtual metrology approach for maintenance compensation to improve yield in semiconductor manufacturing

Authors
Kuo-Yi Lin, Chia-Yu Hsu, Hui-Chun Yu
Corresponding Author
Kuo-Yi Lin
Available Online 1 July 2014.
DOI
https://doi.org/10.1080/18756891.2014.947116How to use a DOI?
Keywords
virtual metrology, manufacturing intelligence, maintenance, yield enhancement, chemical vapor deposition (CVD), semiconductor manufacturing enhancement
Abstract
Process condition was changed by preventative maintenance that may lead to the inconsistency of process output. In practice, process engineers have difficulties to discover the inconsistency that the defect wafer may have been produced before the next measurement. This study proposes a virtual metrology (VM) approach for maintenance compensation in semiconductor manufacturing. The tool process parameter streams were collected to predict the product metrology value, and a relation model was built to adjust the equipment settings for product recipe compensation. An empirical study in maintenance compensation of chemical vapor deposition (CVD) was conducted in a Taiwan semiconductor company for validation. The thickness difference caused by maintenance was reduced from 571Å to 77Å in training data and 564Å to 210Å in testing data. The results showed practical viability of the proposed approach and an intelligent system embedded with the developed algorithm has been implemented.
Open Access
This is an open access article distributed under the CC BY-NC license.

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Journal
International Journal of Computational Intelligence Systems
Volume-Issue
7 - 100
Pages
66 - 73
Publication Date
2014/07
ISSN (Online)
1875-6883
ISSN (Print)
1875-6891
DOI
https://doi.org/10.1080/18756891.2014.947116How to use a DOI?
Open Access
This is an open access article distributed under the CC BY-NC license.

Cite this article

TY  - JOUR
AU  - Kuo-Yi Lin
AU  - Chia-Yu Hsu
AU  - Hui-Chun Yu
PY  - 2014
DA  - 2014/07
TI  - A virtual metrology approach for maintenance compensation to improve yield in semiconductor manufacturing
JO  - International Journal of Computational Intelligence Systems
SP  - 66
EP  - 73
VL  - 7
IS  - sup2
SN  - 1875-6883
UR  - https://doi.org/10.1080/18756891.2014.947116
DO  - https://doi.org/10.1080/18756891.2014.947116
ID  - Lin2014
ER  -