Numerical Simulation of the Temperature Field in the process of EDM Surface Strengthening

DOI

10.2991/ameii-16.2016.233How to use a DOI?

Keywords

surface strengthening, temperature field, numerical simulation

Abstract

A two-dimensional axisymmetric thermal model, whose heat flux is constantly changing both in magnitude and position, is created based on the temperature distribution in the process of EDM surface strengthening. Using the JMatPro software to calculate the TC4 material parameters with the temperature changing, then Using ABAQUS software to simulate temperature field of single pulse EDM. The results show that in the process of strengthening, the discharge point's temperature rises instantly, after declines rapidly, but the rise speed is faster than the decline speed significantly; radial conduction speed is significantly faster than the axial, strengthening process on the substrate performance influence is small.

Copyright

© 2016, the Authors. Published by Atlantis Press.

Open Access

This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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TY  - CONF
AU  - Zhoude Qu
AU  - Liyun Li
AU  - Ping Yang
PY  - 2016/04
DA  - 2016/04
TI  - Numerical Simulation of the Temperature Field in the process of EDM Surface Strengthening
BT  - Proceedings of the 2nd International Conference on Advances in Mechanical Engineering and Industrial Informatics (AMEII 2016)
PB  - Atlantis Press
SP  - 1235
EP  - 1240
SN  - 2352-5401
UR  - https://doi.org/10.2991/ameii-16.2016.233
DO  - 10.2991/ameii-16.2016.233
ID  - Qu2016/04
ER  -