Dynamic analysis for shallowly buried elliptic inclusion near interfacial crack impacted by SH waves in bi-material half space
- DOI
- 10.2991/iccet-15.2015.126How to use a DOI?
- Keywords
- bi-material half space; elliptic inclusion; interfacial crack; conformal mapping; dynamic stress concentration factor (DSCF)
- Abstract
Base on elastodynamics, complex function method with mapping function and Green’s function method are used to investigate the scattering of SH waves and dynamic stress concentration in bi-material half space with elliptic inclusion and interfacial crack. Firstly, the bi-material half space is divided into two parts along the vertical interface. Secondly, “image” method and conformal mapping method are employed to construct the scattering wave field in part I. Then the Green's function needed is obtained. Thirdly, the interfacial crack is created by using crack dividing technique With the aid of interface “conjunction” technique, a series of integral equations for determining the unknown force system could be set up through continuity conditions on the interface and Green’s function. Finally, some examples for the dynamic stress concentration factor (DSCF) around the elliptic elastic inclusion are presented. Numerical results show that the interfacial crack and vertical interface are indeed capable of affecting the distribution of DSCF.
- Copyright
- © 2015, the Authors. Published by Atlantis Press.
- Open Access
- This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).
Cite this article
TY - CONF AU - Xiao-Hao Ding AU - Hui Qi PY - 2015/11 DA - 2015/11 TI - Dynamic analysis for shallowly buried elliptic inclusion near interfacial crack impacted by SH waves in bi-material half space BT - Proceedings of the 5th International Conference on Civil Engineering and Transportation 2015 PB - Atlantis Press SP - 677 EP - 682 SN - 2352-5401 UR - https://doi.org/10.2991/iccet-15.2015.126 DO - 10.2991/iccet-15.2015.126 ID - Ding2015/11 ER -